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SNJ54ABT646AJT Datasheet(PDF) 10 Page - Texas Instruments |
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SNJ54ABT646AJT Datasheet(HTML) 10 Page - Texas Instruments |
10 / 21 page PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) 5962-9457702Q3A ACTIVE LCCC FK 28 1 None Call TI Level-NC-NC-NC 5962-9457702QKA ACTIVE CFP W 24 1 None Call TI Level-NC-NC-NC 5962-9457702QLA ACTIVE CDIP JT 24 1 None Call TI Level-NC-NC-NC SN74ABT646ADBLE OBSOLETE SSOP DB 24 None Call TI Call TI SN74ABT646ADBR ACTIVE SSOP DB 24 2000 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SN74ABT646ADGVR ACTIVE TVSOP DGV 24 2000 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM SN74ABT646ADW ACTIVE SOIC DW 24 25 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR/ Level-1-235C-UNLIM SN74ABT646ADWR ACTIVE SOIC DW 24 2000 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR/ Level-1-235C-UNLIM SN74ABT646ANSR ACTIVE SO NS 24 2000 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SN74ABT646ANT ACTIVE PDIP NT 24 15 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74ABT646APW ACTIVE TSSOP PW 24 60 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM SN74ABT646APWLE OBSOLETE TSSOP PW 24 None Call TI Call TI SN74ABT646APWR ACTIVE TSSOP PW 24 2000 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM SNJ54ABT646AFK ACTIVE LCCC FK 28 1 None Call TI Level-NC-NC-NC SNJ54ABT646AJT ACTIVE CDIP JT 24 1 None Call TI Level-NC-NC-NC SNJ54ABT646AW ACTIVE CFP W 24 1 None Call TI Level-NC-NC-NC (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. PACKAGE OPTION ADDENDUM www.ti.com 4-Mar-2005 Addendum-Page 1 |
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