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20

IADJ

VDD2

GND

UCATTN

GND

BASE

21

22

24

25

26

27

28

29

30

31

32

RFO

LOADJ1

VNEG

VDDIFN

VDDIFP

IFIP

IFIN

GND

MXRO

UCEN

MXRADJ

100pF

LO IN P

100pF

LO IN N

100pF

23

BPF

VDD

IF IN N

IF IN P

100pF

100pF

UCEN

VDD

RF OUT

UCATTN

−VNEG

Place 100pF capacitors as close as possible to package pins.

100pF

1000pF

1000pF

0.01 mF

1 mF

0.01 mF

0.01 mF

Z = 50 W

0.01 mF

0.01 mF

TRF1222

SLWS171A – APRIL 2005 – REVISED DECEMBER 2005

A.

Connect pin 24 to ground through a 0-

Ω resistor.

B.

Place 33-nH inductors close to package pins.

C.

Place 100-pF capacitors close as possible to package pins.

Figure 3. Recommended Application Schematic

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