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NOTE : All Specification subject to change without notice
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52
Pad Layouts
、Solder Reflow and Rework Recommendations
The dimension in the table below provide the recommended pad layout for each FSMD1206 device
Pad dimensions(millimeters)
Device
A
Nominal
B
Nominal
C
Nominal
FSMD005-1206
2.00
1.00
1.90
FSMD010-1206
2.00
1.00
1.90
FSMD020-1206
2.00
1.00
1.90
FSMD035-1206
2.00
1.00
1.90
FSMD050-1206
2.00
1.00
1.90
FSMD075-1206
2.00
1.00
1.90
FSMD100-1206
2.00
1.00
1.90
FSMD150-1206
2.00
1.00
1.90
Solder reflow
※ Due to “Lead Free” nature, Temperature and
Dwelling time for the soldering zone is higher
than those for Regular. This may cause damage to
other components.
1. Recommended reflow methods; IR , vapor phase oven,
hot air oven.
2. The FSMD1206 Series are suitable for use with
wave-solder application methods.
3. Recommended maximum paste thickness is 0.25mm.
4. Devices can be cleaned using standard industry
methods and solvents.
CAUTION:
If reflow temperatures exceed the recommended
Profile, devices may not meet the performance
requirements.
Rework:
Use standard industry practices.
FSMD1206 Series
Surface Mount PTC
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