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MICROFJ-60035-TSV Datasheet(PDF) 8 Page - ON Semiconductor |
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MICROFJ-60035-TSV Datasheet(HTML) 8 Page - ON Semiconductor |
8 / 12 page J−Series SiPM Sensors www.onsemi.com 8 PACKAGE DIMENSIONS (All Dimensions in mm) MicroFJ−40035−TSV *The ‘No Connect’ pins are electrically isolated and should be soldered to a ground (or bias) plane to help with heat dissipation. B1, C1 Anode B4, C4 Fast output A1, D4 Cathode All others No Connect* Pin Number MicroFJ−40035−TSV TOP VIEW SIDE VIEW BOTTOM VIEW Pin Assignments The MicroFJ−40035−TSV CAD, and solder footprint, is available to download here. |
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