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TC51WKM616AXBN75 Datasheet(PDF) 3 Page - Toshiba Semiconductor |
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TC51WKM616AXBN75 Datasheet(HTML) 3 Page - Toshiba Semiconductor |
3 / 11 page TC51WKM616AXBN75 2002-08-22 3/11 ABSOLUTE MAXIMUM RATINGS (See Note 1) SYMBOL RATING VALUE UNIT VDD Power Supply Voltage −1.0 to 3.6 V VDDQ Output Buffer Power Supply Voltage −1.0 to VDD + 0.5 (3.6 V Max) V VIN Input Voltage for Address and Control Pins −1.0 to 3.6 V VI/O Input/Output Voltage for I/O Pins −1.0 to VDDQ + 0.5 V Topr. Operating Temperature −25 to 85 °C Tstrg. Storage Temperature −55 to 150 °C Tsolder Soldering Temperature (10 s) 260 °C PD Power Dissipation 0.6 W IOUT Short Circuit Output Current 50 mA DC RECOMMENDED OPERATING CONDITIONS (Ta = −25°C to 85°C) SYMBOL PARAMETER MIN TYP. MAX UNIT VDD Power Supply Voltage 2.6 2.75 3.3 VDDQ Output Buffer Power Supply Voltage 1.7 1.8 2.2 Input High Voltage for Address and Control Pins 1.6 VDD + 0.3* VIH Input High Voltage for I/O Pins 1.6 VDDQ + 0.3* VIL Input Low Voltage −0.3* 0.4 V * : VIH(Max) VDD+1.0 V/ VDDQ+1.0 V with 10 ns pulse width VIL(Min) -1.0 V with 10 ns pulse width DC CHARACTERISTICS (Ta = −25°C to 85°C, VDD = 2.6 to 3.3 V, VDDQ = 1.7 to 2.2 V) (See Note 3 to 4) SYMBOL PARAMETER TEST CONDITION MIN TYP. MAX UNIT IIL Input Leakage Current VIN = 0 V to VDDQ −1.0 +1.0 µA ILO Output Leakage Current Output disable, VOUT = 0 V to VDD −1.0 +1.0 µA VOH Output High Voltage IOH = − 100 µA VDDQ − 0.2 V VOL Output Low Voltage IOL = 100 µA 0.2 V IDDO1 Operating Current CE1 = VIL CE2 = VIH, IOUT = 0 mA tRC = min 50 mA IDDO2 Page Access Operating Current CE1 = VIL, CE2 = VIH, Page add. cycling, IOUT = 0 mA tPC = min 25 mA IDDS Standby Current(MOS) CE1 = VDD − 0.2 V, CE2 = VDD − 0.2 V 70 µA IDDSD Deep Power-down Standby Current CE2 = 0.2 V 5 µA CAPACITANCE (Ta = 25°C, f = 1 MHz) SYMBOL PARAMETER TEST CONDITION MAX UNIT CIN Input Capacitance VIN = GND 10 pF COUT Output Capacitance VOUT = GND 10 pF Note: This parameter is sampled periodically and is not 100% tested. |
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