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RECEIVER SWITCHING CHARACTERISTICS

S-PIN CHARACTERISTICS

VREF-PIN CHARACTERISTICS

THERMAL CHARACTERISTICS

SN65HVD1050

SLLS632 – DECEMBER 2005

RECEIVER ELECTRICAL CHARACTERISTICS (continued)

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

MAX

UNIT

Input resistance matching

–3%

0%

3%

over recommended operating conditiions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Propagation delay time, low-to-high-level output

60

100

130

ns

Propagation delay time, high-to-low-level output

45

70

90

ns

Output signal rise time

8

ns

Output signal fall time

8

ns

over recommended operating conditiions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

High level input current

S at 2 V

20

40

70

µA

Low level input current

S at 0.8 V

5

20

30

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Reference output voltage

V

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

211

θ

JA

Junction-to-Air

High-K thermal resistance

131

Junction-to-Board Thermal

°C/W

θ

JB

53

Resistance

Junction-to-Case Thermal

θ

JC

79

Resistance

TXD a 500 kHz, 50% duty cycle square wave. CL at

112

mW

RXD = 15 pF

Average power dissipation

TXD a 500 kHz, 50% duty cycle square wave. CL at

170

RXD = 15 pF

Thermal shutdown temperature

190

°C

(1)

Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface-mount packages.

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