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TPA3101D2 Datasheet(PDF) 6 Page - Texas Instruments

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Part No. TPA3101D2
Description  10-W STEREO CLASS-D AUDIO POWER AMPLIFIER
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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TPA3101D2 Datasheet(HTML) 6 Page - Texas Instruments

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TPA3101D2
SLOS473 – DECEMBER 2005
TERMINAL FUNCTIONS (continued)
TERMINAL
I/O
DESCRIPTION
QFN
HTQFP
NAME
NO.
NO.
ROUTP
41, 42
41, 42
O
Class-D 1/2-H-bridge positive output for right channel.
PVCCR
34, 35
34, 35
Power supply for right channel H-bridge, not connected to PVCCL or AVCC.
BSRP
43
43
I/O
Bootstrap I/O for right channel, positive high-side FET.
AGND
4, 17
4, 17
Analog ground for digital/analog cells in core.
ROSC
14
14
I/O
I/O for current setting resistor of ramp generator.
Master/Slave select for determining direction of SYNC terminal.
HIGH=Master mode, SYNC terminal is an output; LOW = slave mode,
MSTR/SLV
10
10
I
SYNC terminal accepts a clock input. TTL logic levels with compliance to
VREG.
Clock input/output for synchronizing multiple class-D devices. Direction
SYNC
11
11
I/O
determined by MSTR/SLV terminal. Input signal not to exceed VREG.
Reference for preamplifier. Nominally equal to 1.25 V. Also controls start-up
VBYP
16
16
O
time via external capacitor sizing.
4-V regulated output for use by internal cells, GAINx, MUTE, and
VREG
15
15
O
MSTR/SLV pins only. Not specified for driving other external circuitry.
High-voltage analog power supply. Not internally connected to PVCCR or
AVCC
48
47, 48
PVCCL.
1, 7, 12,
NC
13, 24, 25,
Not internally connected.
36, 37, 47
Connect to AGND and PGND – should be star point for both grounds.
Internal resistive connection to AGND and PGND. Thermal vias on the PCB
Thermal Pad
-
-
-
should connect this pad to a large copper area on an internal or bottom
layer for the best thermal performance. The Thermal Pad must be soldered
to the PCB for mechanical reliability.
6


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