NCV8504PW50 datasheet(11/14 Pages) ONSEMI

Part #	NCV8504PW50

Description	Micropower 400 mA LDO Linear Regulators with DELAY, Adjustable RESET, and General Use Comparator

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NCV8504 Series

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11

Figure 20. 16 Lead SOW (Exposed Pad),

qJA as a

Function of the Pad Copper Area (2 oz. Cu

Thickness), Board Material = 0.0625

, G−10/R−4

40

70

90

100

0

Copper Area (mm2)

200

400

800

80

60

50

600

HEAT SINKS

A heat sink effectively increases the surface area of the

package to improve the flow of heat away from the IC and

into the surrounding air.

Each material in the heat flow path between the IC and the

outside environment will have a thermal resistance. Like

series electrical resistances, these resistances are summed to

determine the value of RqJA:

R

qJA + RqJC ) RqCS ) RqSA

(3)

where:

RqJC = the junction−to−case thermal resistance,

RqCS = the case−to−heatsink thermal resistance, and

RqSA = the heatsink−to−ambient thermal resistance.

RqJC appears in the package section of the data sheet. Like

RqJA, it too is a function of package type. RqCS and RqSA are

functions of the package type, heatsink and the interface

between them. These values appear in heat sink data sheets

of heat sink manufacturers.

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