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MPC8275ZQ Datasheet(PDF) 57 Page - Motorola, Inc |
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MPC8275ZQ Datasheet(HTML) 57 Page - Motorola, Inc |
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57 / 76 page  MOTOROLA MPC8280 PowerQUICC II™ Family Hardware Specifications 57 Pinout Figure 15. Pinout of the 516 PBGA Package (View from Top) Figure 16 shows the side profile of the PBGA package to indicate the direction of the top surface view. Figure 16. Side View of the PBGA Package Remove 1 234 5 6789 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 Not to Scale 1 234 5 6789 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF Die Transfer molding compound 1 mm pitch Wire bonds attach DIE Ball bond Screen-printed solder mask Cu substrate traces BT resin glass epoxy Plated substrate via |
Similar Part No. - MPC8275ZQ |
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Similar Description - MPC8275ZQ |
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