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NTHD4102PT1 Datasheet(PDF) 2 Page - ON Semiconductor |
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NTHD4102PT1 Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 6 page NTHD4102P http://onsemi.com 2 ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Characteristic Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage V(Br)DSS VGS = 0 V, ID = −250 mA −20 V Drain−to−Source Breakdown Voltage Temperature Coefficient V(Br)DSS/TJ −15 mV/ °C Zero Gate Voltage Drain Current IDSS VGS = 0 V TJ = 25°C −1.0 mA VGS = 0 V VDS = −16 V TJ = 85°C −5.0 Gate−to−Source Leakage Current IGSS VDS = 0 V, VGS = "8.0 V "100 nA ON CHARACTERISTICS (Note 2) Gate Threshold Voltage VGS(TH) VGS = VDS, ID = −250 mA −0.45 −1.5 V Gate Threshold Temperature Coefficient VGS(TH)/TJ 2.7 mV/ °C Drain−to−Source On Resistance RDS(ON) VGS = −4.5 V, ID = −2.9 A 64 80 m W () VGS = −2.5 V, ID = −2.2 A 85 110 VDS = −1.8 V, ID = −1.0 A 120 170 Forward Transconductance gFS VDS = −10 V, ID = −2.9 A 7.0 S CHARGES, CAPACITANCES, AND GATE RESISTANCE Input Capacitance CISS VGS = 0 V, f = 1.0 MHz, 750 pF Output Capacitance COSS VGS = 0 V, f = 1.0 MHz, VDS = −16 V 100 Reverse Transfer Capacitance CRSS DS 45 Total Gate Charge QG(TOT) 7.6 8.6 nC Gate−to−Source Charge QGS VGS = −4.5 V, VDS = −16 V, ID = −2.6 A 1.3 Gate−to−Drain Charge QGD ID = −2.6 A 2.6 SWITCHING CHARACTERISTICS (Note 3) Turn−On Delay Time td(ON) 5.5 10 ns Rise Time tr VGS = −4.5 V, VDD = −16 V, 12 25 Turn−Off Delay Time td(OFF) VGS 4.5 V, VDD 16 V, ID = −2.6 A, RG = 2.0 W 32 40 Fall Time tf 23 35 DRAIN−SOURCE DIODE CHARACTERISTICS Forward Diode Voltage VSD VGS = 0 V, IS = −1.1 A −0.8 −1.2 V Reverse Recovery Time tRR 20 40 ns Charge Time ta VGS = 0 V, dIS/dt = 100 A/ms, 15 Discharge Time tb VGS = 0 V, dIS/dt = 100 A/ms, IS = 1.0 A 5 Reverse Recovery Charge QRR 0.01 mC 2. Pulse test: pulse width ≤ 300 ms, duty cycle ≤ 2% 3. Switching characteristics are independent of operating junction temperatures |
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