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CM3196 Datasheet(PDF) 11 Page - California Micro Devices Corp |
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CM3196 Datasheet(HTML) 11 Page - California Micro Devices Corp |
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11 / 13 page  © 2004 California Micro Devices Corp. All rights reserved. 04/22/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 11 CM3196 Application Information PCB Layout Considerations The CM3196-12SB has a heat spreader attached to the underneath of the PSOP-8 package in order for heat to be transferred easily from the package to the PCB. The heat spreader is a copper pad of dimensions just smaller than the package itself. By positioning the matching pad on the PCB top layer to connect to the spreader during manufacturing, the heat will be trans- ferred between the two pads. The drawing below shows the recommended PCB layout. Note that there are six vias on either side to allow the heat to dissipate into the ground and power planes on the inner layers of the PCB. Vias can be placed underneath the chip, but this can cause blockage of the solder. The ground and power planes should be at least 2 sq. in. of copper adjacent to the vias. It also helps if the chip is posi- tioned away from the edge of the PCB, and not near other heat dissipating devices. A good thermal link from the PCB pad to the rest of the PCB will properly couple the CM3196 package to maintain an ambient junction temperature ( θ JA) of around 40°C/W. Figure 15. Recommended Heat Sink PCB Layout Figure 16. Typical Application Circuit AVIN VDDQ CAVIN 47 µF SD VDDQ PVIN GND VTT CVout 220 µF VTT VSENSE VREF VREF CVREF 0.1 µF SD AVIN PVIN CPVIN 47 µF |
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Similar Description - CM3196 |
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