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TRF7900A Datasheet(PDF) 2 Page - Texas Instruments

Part No. TRF7900A
Description  Fully Integrated Analog Front-End Dual Receiver Base Unit for 27-MHz Wireless Mouse and Keyboard Systems
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
TRF7900A
SWRS031 – OCTOBER 2005
The receiver also generates 8 frequencies that can be programmatically selected via the I2C interface bus for
both the mouse channel and/or the keyboard channel. Another 6-MHz clock is internally generated to clock the
USB microcontroller; this enables a single crystal to be used to supply the clock needs for the receiver channels
and the microcontroller.
The optimized receiver design enables simultaneous reception on both parallel channels up to 5 kHz (10 kbps
Miller encoding) per channel. A receive strength signal indicator register can be read via the I2C bus to determine
the signal strength. Correlating the RSSI reading to the packet error rate enables the controller to diagnose the
signal and understand the user condition.
ORDERING INFORMATION
PACKAGED DEVICES
PACKAGE TYPE
TRANSPORT MEDIA, QUANTITY
TRF7900APW
TSSOP - 28
Rails, 50
TRF7900APWR
TSSOP - 28
Tape and Reel, 2000
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT(1)
VS– to
Supply voltage
5.5
V
VS+
VI
Input voltage
±V
S± 0.5
V
VID
Differential input voltage
±2
V
Continuous power dissipation
See Dissipation Rating Table
TJ
Maximum junction temperature, any condition(2)
150
°C
TJ
Maximum junction temperature, continuous operation, long term
125
°C
reliability(3)
Tstg
Storage temperature range
-65 to 150
°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
300
°C
ESD ratings: Human Body Model
4000
V
ESD ratings: Charged Device Model
1500
V
ESD ratings: Machine Model
200
V
(1)
The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may
cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.
(2)
The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
POWER RATING(2)
PACKAGE
θ
JC
θ
JA
(1)
TA≤ 25°C
TA = 85°C
PW (28)
13.7
56.5
1.77 W
708 mW
(1)
This data was taken using the JEDEC standard high-K test PCB.
(2)
Power rating is determined with a junction temperature of 125
°C. This is the point where distortion starts to substantially increase.
Thermal management of the final PCB should strive to keep the junction temperature at or below 125
°C for best performance and long
term reliability.
2




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