2 / 2 page
Model RFP-250250-4AAXX
Specifications
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Power Derating
Suggested Mounting Procedures
1. Solder part in place using 60/40 type solder with controlled
temperature iron (700°F).
2. Drill thermal vias through PCB and fill with solder, such as
60/40 type.
3. To ensure good thermal connectivity to heat sink, drill and
tap heatsink and mount PCB board to heat sink using
screws.
FILLED VIA
SOLDER
HEATSINK
PC BOARD
PASTE
SOLDER
SCREW
(2 PLS.)
SOLDER
PASTE
P.C.B. SOLDER INTERFACE TEMPERATURE —
°C
150
125
100
75
50
25
100
75
25
50
0
PART NUMBER ATTENUATION (dB)TOL. (+/-dB) WIDTH LENGTH THK POWER (WATTS) VSWR FREQ.(GHz)
RFP-250250-4AA1
1
0.30
0.25
0.25
0.04
8
1.20:1
2.5
RFP-250250-4AA2
2
0.40
0.25
0.25
0.04
8
1.20:1
2.5
RFP-250250-4AA3
3
0.40
0.25
0.25
0.04
8
1.20:1
2.5
RFP-250250-4AA4
4
0.40
0.25
0.25
0.04
8
1.20:1
2.5
RFP-250250-4AA5
5
0.40
0.25
0.25
0.04
8
1.25:1
2.5
RFP-250250-4AA6
6
0.40
0.25
0.25
0.04
8
1.30:1
2.5
RFP-250250-4AA9
9
0.40
0.25
0.25
0.04
8
1.30:1
2.5
RFP-250250-4AA10
10
0.40
0.25
0.25
0.04
8
1.30:1
2.5
RFP-250250-4AA20
20
0.75
0.25
0.25
0.04
8
1.25:1
2.5
RFP-250250-4AA30
30
1.50
0.25
0.25
0.04
8
1.20:1
2.0
Available on Tape and Reel for Pick and Place Manufacturing.
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
