Electronic Components Datasheet Search |
|
HCPL-M701 Datasheet(PDF) 3 Page - Agilent(Hewlett-Packard) |
|
HCPL-M701 Datasheet(HTML) 3 Page - Agilent(Hewlett-Packard) |
3 / 8 page 3 Absolute Maximum Ratings (No Derating Required up to 85 °C) Storage Temperature ................................................. -55 °C to +125°C Operating Temperature ............................................... -40 °C to +85°C Average Input Current - IF ........................................................ 20 mA Peak Input Current - IF .............................................................. 40 mA (50% duty cycle, 1 ms pulse width) Peak Transient Input Current - IF .............................................. 1.0 A ( ≤1 µs pulse width, 300 pps) Reverse Input Voltage - VR .............................................................. 5 V Input Power Dissipation ........................................................... 35 mW Output Current - IO (Pin 5) ........................................................ 60 mA Supply and Output Voltage - VCC (Pin 6-4),VO (Pin 5-4) HCPL-M700 ................................................................... -0.5 V to 7 V HCPL-M701 ................................................................. -0.5 V to 18 V Output Power Dissipation ....................................................... 100 mW Infrared and Vapor Phase Reflow Temperature .................. see below Solder Reflow Thermal Profile Recommended Pb-Free IR Profile 0 TIME (SECONDS) 200 100 50 150 100 200 250 300 0 30 SEC. 50 SEC. 30 SEC. 160°C 140°C 150°C PEAK TEMP. 245°C PEAK TEMP. 240°C PEAK TEMP. 230°C SOLDERING TIME 200°C PREHEATING TIME 150°C, 90 + 30 SEC. 2.5°C ± 0.5°C/SEC. 3°C + 1°C/–0.5°C TIGHT TYPICAL LOOSE ROOM TEMPERATURE PREHEATING RATE 3°C + 1°C/–0.5°C/SEC. REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. Insulation Related Specifications Parameter Symbol Value Units Conditions Min. External Air Gap L(IO1) ≥5 mm Measured from input terminals (Clearance) to output terminals Min. External Tracking Path L(IO2) ≥5 mm Measured from input terminals (Creepage) to output terminals Min. Internal Plastic Gap 0.08 mm Through insulation distance (Clearance) conductor to conductor Tracking Resistance CTI 175 V DIN IEC 112/VDE 0303 Part 1 Isolation Group (per DIN VDE 0109) IIIa Material Group DIN VDE 0109 217 °C RAMP-DOWN 6 °C/SEC. MAX. RAMP-UP 3 °C/SEC. MAX. 150 - 200 °C 260 +0/-5 °C t 25 °C to PEAK 60 to 150 SEC. 20-40 SEC. TIME WITHIN 5 °C of ACTUAL PEAK TEMPERATURE tp ts PREHEAT 60 to 180 SEC. tL TL Tsmax Tsmin 25 Tp TIME NOTES: THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX. Tsmax = 200 °C, Tsmin = 150 °C |
Similar Part No. - HCPL-M701 |
|
Similar Description - HCPL-M701 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |