IN74LV14

2

Symbol

Parameter

Value

Unit

DC supply voltage (Referenced to GND)

-0.5

÷ +7.0

V

1

DC input diode current

±20

mA

2

DC output diode current

±50

mA

DC

output

source

or

sink

current

-bus driver outputs

±25

mA

DC

GND

current

for

types

with

- bus driver outputs

±50

mA

DC

current

for

types

with

- bus driver outputs

±50

mA

Power dissipation per paskade, plastic DIP+

SOIC

package+

750

500

mW

Tstg

Storage temperature

-65

÷ +150

°C

Lead temperature, 1.5 mm from Case for 10

seconds

(Plastic DIP ), 0.3 mm (SOIC Package)

260

°C

Functional operation should be restricted to the Recommended Operating Conditions.

+Derating - Plastic DIP: - 12 mW/

°C from 70° to 125°C

SOIC Package: : - 8 mW/

°C from 70° to 125°C

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

DC Supply Voltage (Referenced to GND)

1.0

5.5

V

DC Input Voltage, Output Voltage (Referenced to

GND)

0

V

Operating Temperature, All Package Types

-40

+125

°C

Input Rise and Fall Time

1.0 V

2.0 V

2.7 V

3.6 V

0

0

0

0

500

200

100

50

ns

This device contains protection circuitry to guard against damage due to high static

voltages or electric fields. However, precautions must be taken to avoid applications of any voltage

Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or