IN74LV04

5

CHIP PAD DIAGRAM IZ74LV04

Pad size 0.108 x 0.108 mm (Pad size is given as per metallization layer)

Thickness of chip 0.46

± 0,02 mm

PAD LOCATION

Pad No

Symbol

X

Y

01

А1

0.111

0.228

02

Y1

0.333

0.111

03

A2

0.600

0.111

04

Y2

0.770

0.111

05

A3

1.006

0.111

06

Y3

1.138

0.293

07

GND

1.138

0.477

08

Y4

1.138

0.786

09

A4

1.006

0.970

10

Y5

0.771

0.970

11

A5

0.600

0.970

12

Y6

0.332

0.970

13

A6

0.111

0.855

14

Vcc

0.111

0.619

01

02

03

04

05

06

07

08

09

10

11

12

13

14

1.35 0.03

±

Chip marking

25LV04

(x=0.127; y=0.580

)