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PE310G4DE4816BIA Datasheet(PDF) 4 Page - Silicom Ltd.

Part No. PE310G4DE4816BIA
Description  Quad Port 10GbE Broadwell DE In-Line System on NIC Network Adapter
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Maker  SILICOM [Silicom Ltd.]
Homepage  https://www.silicom-usa.com/
Logo SILICOM - Silicom Ltd.

PE310G4DE4816BIA Datasheet(HTML) 4 Page - Silicom Ltd.

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Silicom Ltd. Connectivity Solutions
Monitoring of Broadwell-DE SoC power state and thermal status
Low cost design based on the NXP LPC1768 microcontroller
Access provided through a NC-SI interface to the 1Gb Ethernet controller
Serial BMC and Intel console ports for debug (accessible through USB2.0 interface utilizing a 5-pin header on
board as well as remotely through an IPMI client “serial over LAN console”)
Slave SMBus interface for access from the PCIe card interface
Remote Thermal Monitor and Fan Controller (On Semi NCT7491 or equivalent)
PECI 3.0 Interface compatible
On−chip Temperature Sensor
Peripheral Interfaces
3 USB 3.0 ports
One accessible through the front faceplate (Type-A right angle connector)
Two located on PCB toward the rear (Type-A vertical connectors)
Debug Interfaces
2 Extended Debug Ports (XDP)
One for the CPU cores side of the Broadwell-DE SoC
One for the PCH side of the Broadwell-DE SoC
Samtec 60 pin BSH-030-01 series connector for each (not populated in production)
2 virtual serial ports via a USB2.0 Interface
One serial port for Micro-BMC console and programming
One serial port for an Intel console interface sourced from the Broadwell-DE SoC (this console port can also be
connected to the Micro-BMC to be accessed across the Ethernet management port as selected through a jumper )
Micro-B USB right angle connector located along the top board edge
55W typical (75% utilization), 73W Thermal Design Power (max), 173W Peak
12VDC through a 6 pin connector (Molex 45558-0003 or equivalent) located on
rear edge of board
Form Factor
PCI Express Add-in Card, standard height, full length
9.84” x 4.2”, 250mm x 106.7mm

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