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V048K096T025 Datasheet(PDF) 1 Page - Vicor Corporation

Part No. V048K096T025
Description  VI Chip - VTM Voltage Transformation Module
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Maker  VICOR [Vicor Corporation]
Homepage  http://www.vicorpower.com
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V048K096T025 Datasheet(HTML) 1 Page - Vicor Corporation

 
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vicorpower.com
800-735-6200
V•I Chip Voltage Transformation Module
V048K096T025
Rev. 1.0
Page 1 of 15
PRELIMINARY
Product Description
The V048K096T025 V•I Chip Voltage Transformation
Module (VTM) excels at speed, density and efficiency to
meet the demands of advanced DSP, FPGA, and ASIC at
the point of load (POL) while providing isolation from
input to output. It achieves a response time of less than
1 µs and delivers up to 25.0 A in a volume of less than
0.25 in3 with unprecedented efficiency. It may be
paralleled to deliver hundreds of amps at an output
voltage settable from 5.20 to 11.0 Vdc.
The VTM V048K096T025’s nominal output voltage is
9.6 Vdc from a 48 Vdc input Factorized Bus, Vf, and is
controllable from 5.20 to 11.0 Vdc at no load, and from
4.95 to 10.8 Vdc at full load, over a Vf input range of
26 to 55 Vdc. It can be operated either open- or closed-
loop depending on the output regulation needs of the
application. Operating open-loop, the output voltage
tracks its Vf input voltage with a transformation ratio,
K = 1/5 , for applications requiring a programmable
output voltage at high current and high efficiency.
Closing the loop back to an input Pre-Regulation Module
(PRM) or DC-DC converter enables tight load regulation.
The 9.6 V VTM achieves a power density of 974 W/in3 in
a V•I Chip package compatible with standard pick-and-
place and surface mount assembly processes. The
V•I Chip BGA package supports in-board mounting with
a low profile of 0.16" (4 mm) over the board. A J-lead
package option supports on-board surface mounting
with a profile of only 0.25" (6 mm) over the board. The
VTM’s fast dynamic response and low noise eliminate the
need for bulk capacitance at the load, substantially
increasing the POL density while improving reliability and
decreasing cost.
Parameter
Values
Unit
Notes
+In to -In
-1.0 to 60.0
Vdc
+In to -In
100
Vdc
For 100 ms
PC to -In
-0.3 to 7.0
Vdc
VC to -In
-0.3 to 19.0
Vdc
+Out to -Out
-0.1 to 16.0
Vdc
Isolation voltage
2,250
Vdc
Input to Output
Output current
25.0
A
Continuous
Peak output current
37.5
A
For 1 ms
Output power
270
W
Continuous
Peak output power
405
W
For 1 ms
Case temperature
208
°C
During reflow
Operating junction temperature(1)
-40 to 125
°C
T - Grade
-55 to 125
°C
M - Grade
Storage temperature
-40 to 150
°C
T - Grade
-65 to 150
°C
M - Grade
V•I ChipTM – VTM
Voltage Transformation Module
•48V to 9.6 V V•I Chip Converter
• 25.0 A (37.5 A for 1 ms)
•High density – 974 W/in3
•Small footprint – 220 W/in2
• Low weight – 0.5 oz (14 g)
• Pick & Place / SMD
• 125°C operation
•1 µs transient response
• 3.5 million hours MTBF
•Typical efficiency 96%
• No output filtering required
• Surface mount BGA or J-Lead
packages
V048K096T025
Actual size
©
VTM
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
K indicates BGA configuration. For other
mounting options see Part Numbering below.
Output Current
Designator
(=IOUT)
V
048
K
096
T
025
Voltage
Transformation
Module
Input Voltage
Designator
Product Grade Temperatures (°C)
Grade
Storage
Operating
T
-40 to150 -40 to125
M
-65 to150 -55 to125
Configuration Options
F= On-board (Figure 15)
K= In-board (Figure 14)
Output Voltage
Designator
(=VOUT x10)
Part Numbering
Vf = 26 - 55 V
VOUT = 5.20 - 11.0 V
IOUT = 25.0 A
K = 1/5
ROUT = 10.0 mΩ max
Absolute Maximum Ratings


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