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V048K030T070 Datasheet(PDF) 1 Page - Vicor Corporation

Part No. V048K030T070
Description  VI Chip - VTM Voltage Transformation Module
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Maker  VICOR [Vicor Corporation]
Homepage  http://www.vicorpower.com
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V048K030T070 Datasheet(HTML) 1 Page - Vicor Corporation

 
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vicorpower.com
800-735-6200
V•I Chip Voltage Transformation Module
V048K030T070
Rev. 1.0
Page 1 of 15
PRELIMINARY
Product Description
The V048K030T070 V•I Chip Voltage Transformation
Module (VTM) breaks records for speed, density and
efficiency to meet the demands of advanced DSP, FPGA,
and ASIC at the point of load (POL) while providing
isolation from input to output. It achieves a response
time of less than 1 µs and delivers up to 70 A in a
volume of less than 0.25 in3 with unprecedented
efficiency. It may be paralleled to deliver hundreds of
amps at an output voltage settable from 1.63 to 3.43
Vdc.
The VTM V048K030T070’s nominal output voltage is
3 Vdc from a 48 Vdc input Factorized Bus, Vf, and is
controllable from 1.63 to 3.43 Vdc at no load, and from
1.49 to 3.29 Vdc at full load, over a Vf input range of
26 to 55 Vdc. It can be operated either open- or closed-
loop depending on the output regulation needs of the
application. Operating open-loop, the output voltage
tracks its Vf input voltage with a transformation ratio,
K =1/16, for applications requiring a programmable
output voltage at high current and high efficiency.
Closing the loop back to an input Pre-Regulation Module
(PRM) or DC-DC converter enables tight load regulation.
The 3 V VTM achieves break-through current density of
284 A/in3 in a V•I Chip package compatible with standard
pick-and-place and surface mount assembly processes.
The V•I Chip BGA package supports in-board mounting
with a low profile of 0.16" (4 mm) over the board.
A J-lead package option supports on-board surface
mounting with a profile of only 0.25" (6 mm) over the
board. The VTM’s fast dynamic response and low noise
eliminate the need for bulk capacitance at the load,
substantially increasing the POL density while improving
reliability and decreasing cost.
Parameter
Values
Unit
Notes
+In to -In
-1.0 to 60
Vdc
+In to -In
100
Vdc
For 100 ms
PC to -In
-0.3 to 7.0
Vdc
VC to -In
-0.3 to 19.0
Vdc
+Out to -Out
-0.1 to 6.0
Vdc
Isolation voltage
2,250
Vdc
Input to Output
Output current
70
A
Continuous
Peak output current
105
A
For 1 ms
Output power
210
W
Continuous
Peak output power
315
W
For 1 ms
Case temperature
208
°C
During reflow
Operating junction temperature(1)
-40 to 125
°C
T - Grade
-55 to 125
°C
M - Grade
Storage temperature
-40 to 150
°C
T - Grade
-65 to 150
°C
M - Grade
V•I ChipTM – VTM
Voltage Transformation Module
•48V to 3 V V•I Chip Converter
•70A (105 A for 1 ms)
•High density – 284 A/in3
•Small footprint – 60 A/in2
• Low weight – 0.5 oz (14 g)
• Pick & Place / SMD
• 125°C operation
•1 µs transient response
• 3.5 million hours MTBF
•Typical efficiency 94%
• No output filtering required
• Surface mount BGA or J-Lead
packages
V048K030T070
Actual size
©
VTM
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
K indicates BGA configuration. For other
mounting options see Part Numbering below.
Output Current
Designator
(=IOUT)
V
048
K
030
T
070
Voltage
Transformation
Module
Input Voltage
Designator
Product Grade Temperatures (°C)
Grade
Storage
Operating
T
-40 to150 -40 to125
M
-65 to150 -55 to125
Configuration Options
F= On-board (Figure 15)
K= In-board (Figure 14)
Output Voltage
Designator
(=VOUT x10)
Part Numbering
Vf = 26 - 55 V
VOUT = 1.63 - 3.43 V
IOUT = 70 A
K = 1/16
ROUT = 2.0 m
Ω max
Absolute Maximum Ratings


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