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V048K015T090 Datasheet(PDF) 1 Page - Vicor Corporation

Part No. V048K015T090
Description  VI Chip - VTM Voltage Transformation Module
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Maker  VICOR [Vicor Corporation]
Homepage  http://www.vicorpower.com
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V048K015T090 Datasheet(HTML) 1 Page - Vicor Corporation

 
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• 125°C operation
•1 µs transient response
•>3.5 million hours MTBF
•Typical efficiency 93% at 1.5 V/50 A
• No output filtering required
• BGA or J-Lead packages
Vicor Corporation
Tel: 800-735-6200
V•I Chip Voltage Transformation Module
V048K015T090
Rev. 1.0
Page 1 of 16
vicorpower.com
PRELIMIN
ARY
Product Description
The V048K015T090 VI Chip Voltage Transformation
Module (VTM) breaks records for speed, density and
efficiency to meet the demands of advanced DSP,
FPGA, ASIC, processor cores and microprocessor
applications at the point of load (POL) while providing
isolation from input to output. It achieves a response
time of less than 1 µs and delivers up to 90 A in a
volume of less than 0.25 in3 while providing low output
voltages with unprecedented efficiency. It may be
paralleled to deliver hundreds of amps at an output
voltage settable from 0.8 to 1.7 Vdc.
The VTM V048K015T090’s nominal output voltage is
1.5 Vdc from a 48 Vdc input factorized bus, Vf, and is
controllable from 0.8 to 1.7 Vdc at no load, and from
0.8 to 1.6 Vdc at full load, over a Vf input range of 26
to 55 Vdc. It can be operated either open- or closed-loop
depending on the output regulation needs of the
application. Operating open-loop, the output voltage
tracks its Vf input voltage with a transformation ratio,
K = 1/32, and an output resistance, ROUT = 1.0 milliohm, to
enable applications requiring a programmable low
output voltage at high current and high efficiency.
Closing the loop back to an input Pre-Regulation
Module (PRM) or DC-DC converter can compensate
for ROUT.
The 1.5 V VTM achieves break-through current density
of 360 A/in3 in a VI Chip package compatible with
standard pick-and-place and surface mount assembly
processes. The VI Chip BGA package supports in-board
mounting with a low profile of 0.16" (4 mm) over the
board. A J-lead package option supports on-board
surface mounting with a profile of only 0.25" (6 mm)
over the board. The VTM’s fast dynamic response and
low noise eliminate the need for bulk capacitance at the
load, substantially increasing the POL density while
improving reliability and decreasing cost.
Absolute Maximum Ratings
Parameter
Values
Unit
Notes
+In to -In
-1.0 to 60.0
Vdc
+In to -In
100
Vdc
For 100 ms
PC to -In
-0.3 to 7.0
Vdc
TM to -In
-0.3 to 7.0
Vdc
VC to -In
-0.3 to 19.0
Vdc
+Out to -Out
-0.1 to 4.0
Vdc
Isolation voltage
2,250
Vdc
Input to Output
Operating junction temperature
-40 to 125
°C
See Note
Output current
90
A
Continuous
Peak output current
135
A
For 1 ms
Case temperature during reflow
208
°C
Storage temperature
-40 to 150
°C
Output power
145
W
Continuous
Peak output power
217
W
For 1 ms
V•I ChipTM – VTM
Voltage Transformation Module
•48V to 1.5 V V•I Chip Converter
• 90 A (135 A for 1 ms)
•High density – 360 A/in3
•Small footprint – 84 A/in2
• Low weight – 0.5 oz (14 g)
• Pick & Place / SMD
V048K015T090
Vf = 26 - 55 V
VOUT = 0.8 - 1.7 V
IOUT = 90 A
K = 1/32
ROUT = 1.2 m
Ω max
Actual size
©
VTM
Note: The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.
K indicates BGA configuration. For other
mounting options see Part Numbering below.
Output Current
Designator
(=IOUT)
V
048
K
015
T
090
Voltage
Transformation
Module
Input Voltage
Designator
Product Grade Temperatures (°C)
Grade
Storage
Operating
T-40 to150
-40 to125
Configuration Options
A= On-board, elevated (Fig.16)
F= On-board (Fig.15)
K= In-board (Fig.14)
Output Voltage
Designator
(=VOUT x10)
Part Numbering


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