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TLC555CD Datasheet(PDF) 6 Page - Texas Instruments |
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TLC555CD Datasheet(HTML) 6 Page - Texas Instruments |
6 / 42 page 6 TLC555 SLFS043I – SEPTEMBER 1983 – REVISED JULY 2019 www.ti.com Product Folder Links: TLC555 Submit Documentation Feedback Copyright © 1983–2019, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network GND. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1)Continuous total power dissipation and lead temperature parameters from Absolute Maximum Ratings MIN MAX UNIT Voltage Supply, VDD (2) –0.3 18 V Input, any input –0.3 VDD Discharge –0.3 18 Current Sink, discharge or output 150 mA Source, output, IO 15 Temperature Operating, TA C-suffix 0 70 °C I-suffix –40 85 Q-suffix –40 125 M-suffix –55 125 Case, for 60 seconds FK package –65 150 Storage, Tstg –65 150 6.2 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply voltage, VDD TLC555C 2 15 V TLC555I 3 15 TLC555M 5 15 TLC555Q 5 15 Operating free-air temperature, TA TLC555C 0 70 °C TLC555I –40 85 TLC555M –55 125 TLC555Q –40 125 (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.3 Thermal Information THERMAL METRIC(1) TLC555 UNIT D (SOIC) FK (LCCC) JG (CDIP) P (PDIP) PS (SOP) PW (TSSOP) 8 PINS 20 PINS 8 PINS 8 PINS 8 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 113 n/a 120 58 120 135 °C/W RθJC(top) Junction-to-case (top) thermal resistance 58 37 81 48 72 61 °C/W RθJB Junction-to-board thermal resistance 55 36 110 35 69 77 °C/W ψJT Junction-to-top characterization parameter 11 n/a 45 26 32 12 °C/W ψJB Junction-to-board characterization parameter 54 n/a 103 35 68 77 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 4.3 31 n/a n/a n/a °C/W |
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