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DRV8889-Q1 Datasheet(PDF) 65 Page - Texas Instruments

Part No. DRV8889-Q1
Description  DRV8889-Q1, DRV8889A-Q1 Automotive Stepper Driver with Integrated Current Sense, 1/256 Micro-Stepping, and Stall Detection
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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DRV8889-Q1 Datasheet(HTML) 65 Page - Texas Instruments

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Figure 8-17. 4-Layer PCB Junction-to-Ambient
Thermal Resistance (RθJA) vs Copper Area
Figure 8-18. 4-Layer PCB Junction-to-Board
Characterization (ΨJB) Parameter vs Copper Area
8.2.4.4 Thermal Parameters for VQFN Package
Figure 8-19 and Figure 8-20 show the variation of the RθJA (Junction-to-Ambient Thermal Resistance) and ΨJB
(Junction-to-Board Characterization Parameter) with copper-pad area for 2-layer PCB, for the VQFN package.
As shown in these curves, the thermal resistance is lower for the higher copper thickness PCB and the higher
copper pad-area.
Similarly, Figure 8-21 and Figure 8-22 show the variation of the RθJA and ΨJB with copper-pad area for 4-layer
PCB respectively, for the VQFN package.
Note
The thermal parameters (RθJA (Junction-to-Ambient Thermal Resistance) and ΨJB (Junction-to-Board
Characterization Parameter)) are calculated considering the ambient temperature of 25°C and with 2-
W power evenly dissipated between high-side and low-side FET's. The thermal parameters calculated
considering the power dissipation at the actual location of the power-FETs rather than an averaged
estimation.
The thermal parameters are highly dependent on the external conditions such as altitude, package
geometry etc. Refer to Application Report for more details.
www.ti.com
DRV8889-Q1
SLVSEE9C – APRIL 2020 – REVISED AUGUST 2020
Copyright © 2020 Texas Instruments Incorporated
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