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CC3130 Datasheet(PDF) 26 Page - Texas Instruments |
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CC3130 Datasheet(HTML) 26 Page - Texas Instruments |
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26 / 75 page  8.13 BLE/2.4 GHz Radio Coexistence and WLAN Coexistence Requirements For proper BLE/2.4 GHz radio coexistence, the following requirements needs to met: Table 8-3. COEX Isolation Requirement PARAMETER Band MIN TYP MAX UNIT Port-to-port isolation Single antenna 20(1) dB Dual antenna Configuration 20(2) (1) WLAN/BLE switch used must provide a minimum of 20 dB isolation between ports. (2) For dual antenna configuration antenna placement must be such that isolation between the BLE and WLAN ports is at least 20 dB. 8.14 Thermal Resistance Characteristics for RGK Package THERMAL METRICS(1) °C/W(2) (3) AIR FLOW (m/s)(4) RΘJC Junction-to-case 6.3 0.0051 RΘJB Junction-to-board 2.4 0.0051 RΘJA Junction-to-free air 23 0.0051 RΘJMA Junction-to-moving air 14.6 0.765 12.4 1.275 10.8 2.55 PsiJT Junction-to-package top 0.2 0.0051 0.2 0.765 0.3 1.275 0.1 2.55 PsiJB Junction-to-board 2.3 0.0051 2.3 0.765 2.2 1.275 2.4 2.55 (1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics. (2) °C/W = degrees Celsius per watt. (3) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/ JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements Power dissipation of 2 W and an ambient temperature of 70°C is assumed. (4) m/s = meters per second. 8.15 Timing and Switching Characteristics 8.15.1 Power Supply Sequencing For proper operation of the CC3130 device, perform the recommended power-up sequencing as follows: 1. Tie the following pins together on the board: • VBAT (pins 37, 39, and 44) • VIO (pins 54 and 10) 2. Hold the RESET pin low while the supplies are ramping up. TI recommends using a simple RC circuit (100 K ||, 0.01 µF, RC = 1 ms). 3. For an external RTC, ensure that the clock is stable before RESET is deasserted (high). For timing diagrams, see Section 8.15.3. CC3130 SWRS227 – MARCH 2020 www.ti.com 26 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated |
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