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BQ24160 Datasheet(PDF) 49 Page - Texas Instruments |
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BQ24160 Datasheet(HTML) 49 Page - Texas Instruments |
49 / 53 page NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PACKAGE OUTLINE www.ti.com 4219016 / A 08/2017 VQFN - 1 mm max height PLASTIC QUAD FLATPACK- NO LEAD RGE0024H A 0.08 C 0.1 C A B 0.05 C B SYMM SYMM 4.1 3.9 4.1 3.9 PIN 1 INDEX AREA 1 MAX 0.05 0.00 SEATING PLANE C 2X 2.5 2X 2.5 20X 0.5 1 6 7 12 13 18 19 24 24X 0.30 0.18 24X 0.48 0.28 (0.2) TYP PIN 1 ID (OPTIONAL) 25 |
Similar Part No. - BQ24160_V01 |
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Similar Description - BQ24160_V01 |
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