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S2600GZ Datasheet(PDF) 26 Page - Intel Corporation

Part # S2600GZ
Description  Technical Product Specification
Download  246 Pages
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Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

S2600GZ Datasheet(HTML) 26 Page - Intel Corporation

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Product Architecture Overview
Intel® Server Board S2600GZ/GL TPS
3.1
Processor Support
The server board includes two Socket-R (LGA2011) processor sockets and can support one or two of the
following processors:
Intel
® Xeon® processor E5-2600 product family, with a Thermal Design Power (TDP) of up to 135W.
Intel
® Xeon® processor E5-2600 v2 product family, with a Thermal Design Power (TDP) of up to 130W.
Note: Previous generation Intel
® Xeon® processors are not supported on the Intel server boards described in
this document.
Table 2. Supported Intel
® Xeon® processor product family feature comparison table
Feature
Intel
® Xeon® E5-2600 processor
product family
Intel
® Xeon® E5-2600 processor v2
product family
QPI Speed (GT/s)
8.0, 7.2, and 6.4
Addressability
46 bits physical, 48 bits virtual
Cores
Up to 8
Up to 12
Threads Per Socket
Up to 16 threads
Up to 24 threads
Last-Level Cache (LLC)
Up to 20 MB
Up to 30 MB
Intel® Turbo-Boost Technology
YES
Memory Population
4 Channels of up to 3 RDIMMs, 3 LRDIMMs, or 2 UDIMMs
Max Memory Speed
Up to 1600
Up to 1866
Memory RAS
ECC, Patrol Scrubbing, Demand Scrubbing, Sparing, Mirroring, Lockstep Mode, x4/x8 SDDC
PCIe* Lanes / Controllers /
Speed (GT/s)
40 / 10 (PCIe* 3.0 at 8 GT/s)
Idle Power Targets (W)
15 W or higher, 12 W for LV SKUs
10.5 W or higher, 7.5 W for LV SKUs
Visit http://www.intel.com/support.for a complete list of supported processors.
3.1.1
Processor Socket Assembly
Each processor socket of the server board is pre-assembled with an Independent Latching Mechanism (ILM)
and Back Plate which allow for secure placement of the processor and processor heat to the server board.
The illustration below identifies each sub-assembly component:
Revision 2.4
12


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