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MC9S08PT16 Datasheet(PDF) 3 Page - NXP Semiconductors

Part # MC9S08PT16
Description  8-Bit S08 central processor unit (CPU)
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MC9S08PT16 Datasheet(HTML) 3 Page - NXP Semiconductors

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Table of Contents
1 MCU block diagram...........................................................................4
2 Orderable part numbers......................................................................5
3 Part identification............................................................................... 6
3.1 Description.................................................................................6
3.2 Format........................................................................................6
3.3 Fields..........................................................................................6
3.4 Example..................................................................................... 6
4 Parameter Classification.....................................................................7
5 Ratings................................................................................................7
5.1 Thermal handling ratings...........................................................7
5.2 Moisture handling ratings.......................................................... 7
5.3 ESD handling ratings.................................................................8
5.4 Voltage and current operating ratings........................................8
6 General............................................................................................... 9
6.1 Nonswitching electrical specifications...................................... 9
6.1.1
DC characteristics........................................................ 9
6.1.2
Supply current characteristics...................................... 15
6.1.3
EMC performance........................................................17
6.2 Switching specifications............................................................ 17
6.2.1
Control timing..............................................................17
6.2.2
Debug trace timing specifications................................18
6.2.3
FTM module timing.....................................................19
6.3 Thermal specifications...............................................................20
6.3.1
Thermal characteristics................................................ 20
7 Peripheral operating requirements and behaviors.............................. 21
7.1 External oscillator (XOSC) and ICS characteristics..................21
7.2 NVM specifications................................................................... 23
7.3 Analog........................................................................................24
7.3.1
ADC characteristics..................................................... 24
7.3.2
Analog comparator (ACMP) electricals...................... 27
7.4 Communication interfaces......................................................... 27
7.4.1
SPI switching specifications........................................ 27
7.5 Human-machine interfaces (HMI).............................................31
7.5.1
TSI electrical specifications.........................................31
8 Dimensions.........................................................................................31
8.1 Obtaining package dimensions.................................................. 31
9 Pinout................................................................................................. 32
9.1 Signal multiplexing and pin assignments.................................. 32
9.2 Device pin assignment...............................................................34
10 Revision history................................................................................. 36
MC9S08PT16 Series Data Sheet, Rev. 4, 03/2020
NXP Semiconductors
3


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