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MC9S08PT16 Datasheet(PDF) 3 Page - NXP Semiconductors |
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MC9S08PT16 Datasheet(HTML) 3 Page - NXP Semiconductors |
3 / 37 page Table of Contents 1 MCU block diagram...........................................................................4 2 Orderable part numbers......................................................................5 3 Part identification............................................................................... 6 3.1 Description.................................................................................6 3.2 Format........................................................................................6 3.3 Fields..........................................................................................6 3.4 Example..................................................................................... 6 4 Parameter Classification.....................................................................7 5 Ratings................................................................................................7 5.1 Thermal handling ratings...........................................................7 5.2 Moisture handling ratings.......................................................... 7 5.3 ESD handling ratings.................................................................8 5.4 Voltage and current operating ratings........................................8 6 General............................................................................................... 9 6.1 Nonswitching electrical specifications...................................... 9 6.1.1 DC characteristics........................................................ 9 6.1.2 Supply current characteristics...................................... 15 6.1.3 EMC performance........................................................17 6.2 Switching specifications............................................................ 17 6.2.1 Control timing..............................................................17 6.2.2 Debug trace timing specifications................................18 6.2.3 FTM module timing.....................................................19 6.3 Thermal specifications...............................................................20 6.3.1 Thermal characteristics................................................ 20 7 Peripheral operating requirements and behaviors.............................. 21 7.1 External oscillator (XOSC) and ICS characteristics..................21 7.2 NVM specifications................................................................... 23 7.3 Analog........................................................................................24 7.3.1 ADC characteristics..................................................... 24 7.3.2 Analog comparator (ACMP) electricals...................... 27 7.4 Communication interfaces......................................................... 27 7.4.1 SPI switching specifications........................................ 27 7.5 Human-machine interfaces (HMI).............................................31 7.5.1 TSI electrical specifications.........................................31 8 Dimensions.........................................................................................31 8.1 Obtaining package dimensions.................................................. 31 9 Pinout................................................................................................. 32 9.1 Signal multiplexing and pin assignments.................................. 32 9.2 Device pin assignment...............................................................34 10 Revision history................................................................................. 36 MC9S08PT16 Series Data Sheet, Rev. 4, 03/2020 NXP Semiconductors 3 |
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