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SN74AVC32T245NMJ Datasheet(PDF) 8 Page - Texas Instruments

Part # SN74AVC32T245NMJ
Description  SN74AVC32T245 32-Bit Dual-Supply Bus Transceiver With Configurable Voltage Translation, Level-Shifting, and Tri-State Outputs
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

SN74AVC32T245NMJ Datasheet(HTML) 8 Page - Texas Instruments

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6.3 Recommended Operating Conditions
See (1) (2) (3)
VCCI
VCCO
MIN
MAX
UNIT
VCCA
Supply voltage
1.2
3.6
V
VCCB
Supply voltage
1.2
3.6
V
VIH
High-level input voltage
Data inputs(4)
1.2 V to 1.95 V
VCCI × 0.65
V
1.95 V to 2.7 V
1.6
2.7 V to 3.6 V
2
VIL
Low-level input voltage
Data inputs(4)
1.2 V to 1.95 V
VCCI × 0.35
V
1.95 V to 2.7 V
0.7
2.7 V to 3.6 V
0.8
VIH
High-level input voltage
DIR
(referenced to VCCA)(5)
1.2 V to 1.95 V
VCCA × 0.65
V
1.95 V to 2.7 V
1.6
2.7 V to 3.6 V
2
VIL
Low-level input voltage
DIR
(referenced to VCCA)(5)
1.2 V to 1.95 V
VCCA × 0.35
V
1.95 V to 2.7 V
0.7
2.7 V to 3.6 V
0.8
VI
Input voltage
0
3.6
V
VO
Output voltage
Active state
0
VCCO
V
3-state
0
3.6
IOH
High-level output current
1.2 V
–3
mA
1.4 V to 1.6 V
–6
1.65 V to 1.95 V
–8
2.3 V to 2.7 V
–9
3 V to 3.6 V
–12
IOL
Low-level output current
1.2 V
3
mA
1.4 V to 1.6 V
6
1.65 V to 1.95 V
8
2.3 V to 2.7 V
9
3 V to 3.6 V
12
Δt/Δv
Input transition rise or fall rate
5
ns/V
TA
Operating free-air temperature
–40
85
°C
(1)
VCCI is the VCC associated with the data input port.
(2)
VCCO is the VCC associated with the output port.
(3)
All unused data inputs of the device must be held at VCCI or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
(4)
For VCCI values not specified in the data sheet, VIH min = VCCI × 0.7 V, VIL max = VCCI × 0.3 V.
(5)
For VCCI values not specified in the data sheet, VIH min = VCCA × 0.7 V, VIL max = VCCA × 0.3 V.
6.4 Thermal Information
THERMAL METRIC(1)
SN74AVC32T245
UNIT
GKE/ZKE
(LFBGA)
ZRL
(MICROSTAR
JUNIOR)
NMJ (nFBGA)
96 PINS
96 PINS
96 PINS
RθJA
Junction-to-ambient thermal resistance
70.7
105.8
26.7
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
34.0
1.6
14.4
°C/W
RθJB
Junction-to-board thermal resistance
43.5
10.8
10.7
°C/W
ψJT
Junction-to-top characterization parameter
3.5
3.1
1.3
°C/W
ψJB
Junction-to-board characterization parameter
43.5
10.8
10.5
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
SN74AVC32T245
SCES553G – MAY 2004 – REVISED JULY 2020
www.ti.com
8
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