SN74AVC32T245NMJ datasheet(8/30 Pages) TI1 | SN74AVC32T245 32-Bit Dual-Supply Bus Transceiver With Configurable Voltage Translation, Level-Shifting, and Tri-State Outputs

Part #	SN74AVC32T245NMJ

Description	SN74AVC32T245 32-Bit Dual-Supply Bus Transceiver With Configurable Voltage Translation, Level-Shifting, and Tri-State Outputs

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6.3 Recommended Operating Conditions

See (1) (2) (3)

VCCI

VCCO

MIN

MAX

UNIT

VCCA

Supply voltage

1.2

3.6

V

VCCB

Supply voltage

1.2

3.6

V

VIH

High-level input voltage

Data inputs(4)

1.2 V to 1.95 V

VCCI × 0.65

V

1.95 V to 2.7 V

1.6

2.7 V to 3.6 V

2

VIL

Low-level input voltage

Data inputs(4)

1.2 V to 1.95 V

VCCI × 0.35

V

1.95 V to 2.7 V

0.7

2.7 V to 3.6 V

0.8

VIH

High-level input voltage

DIR

(referenced to VCCA)(5)

1.2 V to 1.95 V

VCCA × 0.65

V

1.95 V to 2.7 V

1.6

2.7 V to 3.6 V

2

VIL

Low-level input voltage

DIR

(referenced to VCCA)(5)

1.2 V to 1.95 V

VCCA × 0.35

V

1.95 V to 2.7 V

0.7

2.7 V to 3.6 V

0.8

VI

Input voltage

0

3.6

V

VO

Output voltage

Active state

0

VCCO

V

3-state

0

3.6

IOH

High-level output current

1.2 V

–3

mA

1.4 V to 1.6 V

–6

1.65 V to 1.95 V

–8

2.3 V to 2.7 V

–9

3 V to 3.6 V

–12

IOL

Low-level output current

1.2 V

3

mA

1.4 V to 1.6 V

6

1.65 V to 1.95 V

8

2.3 V to 2.7 V

9

3 V to 3.6 V

12

Δt/Δv

Input transition rise or fall rate

5

ns/V

TA

Operating free-air temperature

–40

85

°C

(1)

VCCI is the VCC associated with the data input port.

(2)

VCCO is the VCC associated with the output port.

(3)

All unused data inputs of the device must be held at VCCI or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

(4)

For VCCI values not specified in the data sheet, VIH min = VCCI × 0.7 V, VIL max = VCCI × 0.3 V.

(5)

For VCCI values not specified in the data sheet, VIH min = VCCA × 0.7 V, VIL max = VCCA × 0.3 V.

6.4 Thermal Information

THERMAL METRIC(1)

SN74AVC32T245

UNIT

GKE/ZKE

(LFBGA)

ZRL

(MICROSTAR

JUNIOR)

NMJ (nFBGA)

96 PINS

RθJA

Junction-to-ambient thermal resistance

70.7

105.8

26.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

34.0

1.6

14.4

°C/W

RθJB

Junction-to-board thermal resistance

43.5

10.8

10.7

°C/W

ψJT

Junction-to-top characterization parameter

3.5

3.1

1.3

°C/W

ψJB

Junction-to-board characterization parameter

43.5

10.8

10.5

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

SN74AVC32T245

SCES553G – MAY 2004 – REVISED JULY 2020

www.ti.com

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