Electronic Components Datasheet Search
  English  ▼

Delete All
ON OFF
ALLDATASHEET.COM

X  

Preview PDF Download HTML

MC9S08PA60A Datasheet(PDF) 3 Page - NXP Semiconductors

Part No. MC9S08PA60A
Description  MC9S08PA60A and MC9S08PA32A are recommended for new design
Download  41 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MC9S08PA60A Datasheet(HTML) 3 Page - NXP Semiconductors

  MC9S08PA60A Datasheet HTML 1Page - NXP Semiconductors MC9S08PA60A Datasheet HTML 2Page - NXP Semiconductors MC9S08PA60A Datasheet HTML 3Page - NXP Semiconductors MC9S08PA60A Datasheet HTML 4Page - NXP Semiconductors MC9S08PA60A Datasheet HTML 5Page - NXP Semiconductors MC9S08PA60A Datasheet HTML 6Page - NXP Semiconductors MC9S08PA60A Datasheet HTML 7Page - NXP Semiconductors MC9S08PA60A Datasheet HTML 8Page - NXP Semiconductors MC9S08PA60A Datasheet HTML 9Page - NXP Semiconductors Next Button
Zoom Inzoom in Zoom Outzoom out
 3 / 41 page
background image
Table of Contents
1 MCU block diagram...........................................................................4
2 Orderable part numbers......................................................................6
3 Part identification............................................................................... 7
3.1 Description.................................................................................7
3.2 Format........................................................................................7
3.3 Fields..........................................................................................7
3.4 Example..................................................................................... 7
4 Parameter Classification.....................................................................8
5 Ratings................................................................................................8
5.1 Thermal handling ratings...........................................................8
5.2 Moisture handling ratings.......................................................... 8
5.3 ESD handling ratings.................................................................9
5.4 Voltage and current operating ratings........................................9
6 General............................................................................................... 10
6.1 Nonswitching electrical specifications...................................... 10
6.1.1
DC characteristics........................................................ 10
6.1.2
Supply current characteristics...................................... 16
6.1.3
EMC performance........................................................17
6.2 Switching specifications............................................................ 18
6.2.1
Control timing..............................................................18
6.2.2
Debug trace timing specifications................................19
6.2.3
FTM module timing.....................................................20
6.3 Thermal specifications...............................................................21
6.3.1
Thermal operating requirements.................................. 21
6.3.2
Thermal characteristics................................................ 21
7 Peripheral operating requirements and behaviors.............................. 22
7.1 External oscillator (XOSC) and ICS characteristics..................22
7.2 NVM specifications................................................................... 24
7.3 Analog........................................................................................25
7.3.1
ADC characteristics..................................................... 25
7.3.2
Analog comparator (ACMP) electricals...................... 28
7.4 Communication interfaces......................................................... 29
7.4.1
SPI switching specifications........................................ 29
8 Dimensions.........................................................................................32
8.1 Obtaining package dimensions.................................................. 32
9 Pinout................................................................................................. 33
9.1 Signal multiplexing and pin assignments.................................. 33
9.2 Device pin assignment...............................................................35
10 Revision history................................................................................. 39
MC9S08PA60 Series Data Sheet, Rev. 4, 09/2019
NXP Semiconductors
3


Html Pages

1  2  3  4  5  6  7  8  9  10  11  12  13  14  15  16  17  18  19  20  21  22  23  24  25  26  27  28  29  30  31  32  33  34  35  36  37  38  39  40  41 


Datasheet Download

Go To PDF Page


Link URL




Privacy Policy
ALLDATASHEET.COM
Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Datasheet Upload   |   Contact us   |   Privacy Policy   |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn