FM5820-B THRU FM5822-B

Features

Plastic package has Underwriters Laboratory

Flammability Classification 94V-O Utilizing Flame

Retardant Epoxy Molding Compound.

For surface mounted applications.

Exceeds environmental standards of MIL-S-19500 /

228

Low leakage current.

Mechanical data

Case : Molded plastic, JEDECDO-214AA

Terminals : Solder plated, solderable per MIL-STD-750,

Method 2026

Polarity : Indicated by c athode band

Mounting Position : Any

Weight : 0.00878 ounce, 0.293 gram

(V)

(V)

(V)

(V)

FM5820

SK32

20

14

20

0.475

FM5821

SK33

30

21

30

0.500

FM5822

SK34

40

28

40

0.525

SYMBOLS

MARKING

CODE

-55 to +125

Storage

temperature

V

RRM

*1

V

RMS

*2

V

R

*3

V

F

*4

PARAMETER

CONDITIONS

Symbol

MIN.

TYP.

MAX.

UNIT

Forward rectified current

See Fig.1

3.0

A

Forward surge current

8.3ms single half sine-wave superimposed on

rate load (JEDEC methode)

80

A

25

0.5

mA

20

mA

Thermal resistance

Junction to ambient

55

Diode junction capacitance

f=1MHz and applied 4vDC reverse voltage

250

pF

Operating temperature

-55

+150

Reverse current

*1 Repetitive peak reverse voltage

*2 RMS voltage

*3 Continuous reverse voltage

*4 Maximum forward voltage

Chip Schottky Barrier Diodes

Silicon epitaxial planer type

Formosa MS

0.213(5.4)

0.197(5.0)

0.016(0.4) Typ.

0.142(3.6)

0.126(3.2)

0.173(4.4)

0.157(4.0)

0.075(1.9)

0.067(1.7)

0.040 (1.0) Typ.

0.040(1.0) Typ.

Dimensions in inches and (millimeters)

SMB