FM820 THRU FM860

Features

Plastic package has Underwriters Laboratory

Flammability Classification 94V-O Utilizing Flame

Retardant Epoxy Molding Compound.

For surface mounted applications.

Exceeds environmental standards of MIL-S-19500 /

228

Low leakage current.

Mechanical data

Case : Molded plastic, JEDECDO-214AB

Terminals : Solder plated, solderable per MIL-STD-750,

Method 2026

Polarity : Indicated by c athode band

Mounting Position : Any

Weight : 0.00585 ounce, 0.195 gram

(V)

(V)

(V)

(V)

(

FM820

SK82

20

14

20

FM830

SK83

30

21

30

FM840

SK84

40

28

40

FM850

SK85

50

35

50

FM860

SK86

60

42

60

0.70

SYMBOLS

MARKING

CODE

-55 to +125

Operating

temperature

*1

*2

*3

*4

0.65

PARAMETER

CONDITIONS

Symbol

MIN.

TYP.

MAX.

UNIT

Forward rectified current

See Fig.1

8.0

A

Forward surge current

8.3ms single half sine-wave superimposed on

rate load (JEDEC methode)

150

A

5.0

mA

50

mA

Thermal resistance

Junction to ambient

55

Diode junction capacitance

f=1MHz and applied 4vDC reverse voltage

700

pF

Storage temperature

-55

+150

Reverse current

*1 Repetitive peak reverse voltage

*2 RMS voltage

*3 Continuous reverse voltage

*4 Maximum forward voltage

Chip Schottky Barrier Diodes

Silicon epitaxial planer type

Formosa MS

0.276(7.0)

0.260(6.6)

0.012(0.3) Typ.

0.189(4.8)

0.173(4.4)

0.244(6.2)

0.228(5.8)

0.087(2.2)

0.071(1.8)

0.040 (1.0) Typ.

0.040(1.0) Typ.

Dimensions in inches and (millimeters)

SMC

0.152(3.8)

0.144(3.6)

0.032(0.8) Typ.