FM120-M

THRU FM1100-M

HH

Features

Plastic package has Underwriters Laboratory

Flammability Classification 94V-O Utilizing Flame

Retardant Epoxy Molding Compound.

For surface mounted applications.

Exceeds environmental standards of MIL-S-19500 /

228

Low leakage current.

Mechanical data

Case : Molded plastic, JEDECSOD-123H

Terminals : Solder plated, solderable per MIL-STD-750,

Method 2026

Polarity : Indicated by c athode band

Mounting Position : Any

Weight : 0.0393 gram

(V)

(V)

(V)

(V)

(

FM120-MH

12

20

14

20

FM130-MH

13

30

21

30

FM140-MH

14

40

28

40

FM150-MH

15

50

35

50

FM160-MH

16

60

42

60

FM180-MH

18

80

56

80

FM1100-MH

10

100

70

100

0.50

0.70

0.85

-55 to +125

-55 to +150

SYMBOLS

MARKING

CODE

Operating

temperature

*1

*2

*3

*4

PARAMETER

CONDITIONS

Symbol

MIN.

TYP.

MAX.

UNIT

Forward rectified current

See Fig.1

1.0

A

Forward surge current

8.3ms single half sine-wave superimposed on

rate load (JEDEC methode)

25

A

25

0.5

mA

10

mA

Thermal resistance

Junction to ambient

98

Diode junction capacitance

f=1MHz and applied 4vDC reverse voltage

120

pF

Storage temperature

-55

+150

Reverse current

*1 Repetitive peak reverse voltage

*2 RMS voltage

*3 Continuous reverse voltage

*4 Maximum forward voltage

Chip Schottky Barrier Diodes

Silicon epitaxial planer type

Formosa MS

0.146(3.7)

0.130(3.3)

0.012(0.3) Typ.

0.071(1.8)

0.055(1.4)

0.035(0.9)

0.028(0.7)

0.031(0.8) Typ.

0.031(0.8) Typ.

Dimensions in inches and (millimeters)

SOD-123H