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MC74VHC374 Datasheet(PDF) 1 Page - Motorola, Inc

Part No. MC74VHC374
Description  Octal D-Type Flip-Flop with 3-State Output
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Maker  MOTOROLA [Motorola, Inc]
Homepage  http://www.freescale.com
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MC74VHC374 Datasheet(HTML) 1 Page - Motorola, Inc

   
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
1
REV 1
© Motorola, Inc. 1997
6/97
Octal D-Type Flip-Flop
with 3-State Output
The MC74VHC374 is an advanced high speed CMOS octal flip–flip with
3–state output fabricated with silicon gate CMOS technology. It achieves
high speed operation similar to equivalent Bipolar Schottky TTL while
maintaining CMOS low power dissipation.
This 8–bit D–type flip–flop is controlled by a clock input and an output
enable input. When the output enable input is high, the eight outputs are in a
high impedance state.
The internal circuit is composed of three stages, including a buffer output
which provides high noise immunity and stable output. The inputs tolerate
voltages up to 7V, allowing the interface of 5V systems to 3V systems.
• High Speed: fmax = 185MHz (Typ) at VCC = 5V
• Low Power Dissipation: ICC = 4µA (Max) at TA = 25°C
• High Noise Immunity: VNIH = VNIL = 28% VCC
• Power Down Protection Provided on Inputs
• Balanced Propagation Delays
• Designed for 2V to 5.5V Operating Range
• Low Noise: VOLP = 0.9V (Max)
• Pin and Function Compatible with Other Standard Logic Families
• Latchup Performance Exceeds 300mA
• ESD Performance: HBM > 2000V; Machine Model > 200V
• Chip Complexity: 266 FETs or 66.5 Equivalent Gates
LOGIC DIAGRAM
DATA
INPUTS
D0
D1
D2
D3
D4
D5
D6
D7
18
17
14
13
8
7
4
3
1
OE
19
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
16
15
12
9
6
5
2
NONINVERTING
OUTPUTS
11
CP
OE
CP
Q
L
L
L
H
L, H,
X
H
L
No Change
Z
INPUTS
OUTPUT
FUNCTION TABLE
D
H
L
X
X
MC74VHC374
DW SUFFIX
20–LEAD SOIC PACKAGE
CASE 751D–04
ORDERING INFORMATION
MC74VHCXXXDW
MC74VHCXXXDT
MC74VHCXXXM
SOIC
TSSOP
SOIC EIAJ
DT SUFFIX
20–LEAD TSSOP PACKAGE
CASE 948E–02
PIN ASSIGNMENT
Q2
D1
D0
Q0
OE
GND
Q3
D3
D2
Q1
5
4
3
2
1
10
9
8
7
6
14
15
16
17
18
19
20
11
12
13
Q6
D6
D7
Q7
VCC
CP
Q4
D4
D5
Q5
M SUFFIX
20–LEAD SOIC EIAJ PACKAGE
CASE 967–01


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