Electronic Components Datasheet Search |
|
CXG1173UR Datasheet(PDF) 5 Page - Sony Corporation |
|
CXG1173UR Datasheet(HTML) 5 Page - Sony Corporation |
5 / 5 page – 5 – CXG1173UR Sony Corporation Package Outline Unit: mm PIN 1 INDEX C 0.1 S A-B 0.4 0.05 M S C C A-B S 0.05 S + 0.09 12PIN UQFN PLASTIC 0.25 – 0.03 + 0.09 0.14 – 0.03 x 4 2.0 4 1 3 9 7 6 12 10 S 0.4 ± 0.1 0.6 0.55 ± 0.05 4-R0.2 A B 0.25 0.07 0.18 SONY CODE EIAJ CODE JEDEC CODE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.01g PACKAGE STRUCTURE UQFN-12P-01 PACKAGE MASS TERMINAL SECTION Note:Cutting burr of lead are 0.05mm MAX. Solder Plating LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL COPPER ALLOY SOLDER COMPOSITION Sn-Bi Bi:1-4wt% PLATING THICKNESS 5-18 µm SPEC. |
Similar Part No. - CXG1173UR |
|
Similar Description - CXG1173UR |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |