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FSD210B Datasheet(PDF) 4 Page - Fairchild Semiconductor |
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FSD210B Datasheet(HTML) 4 Page - Fairchild Semiconductor |
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4 / 18 page 
FSD210B, FSD200B 4 Absolute Maximum Ratings (Ta=25 °C, unless otherwise specified) Thermal Impedance (Ta=25 °C, unless otherwise specified) Note: 1. Free standing with no heatsink. / Measurement Condition : Just before junction temperature TJ enters into OTP. 2. Measured on the DRAIN pin close to plastic interface. 3. Soldered to 100mm2 copper clad. 4. Soldered to 300mm2 copper clad. 5. Without copper clad. - all items are tested with the standards JESD 51-2, 51-3 (SOP) and 51-10 (DIP). Characteristic Symbol Value Unit Drain Pin Voltage 7DIP VDRAIN 700 V Vstr Pin Voltage VSTR 700 V Total Power Dissipation PD 1.68 W Drain Pin Voltage 7LSOP VDRAIN 670 V Vstr Pin Voltage VSTR 670 V Total Power Dissipation PD 1.45 W Supply Voltage FSD200B VCC 10 V Feedback Voltage Range VFB -0.3 to VCC V Supply Voltage FSD210B VCC 20 V Feedback Voltage Range VFB -0.3 to VSTOP V Operating Junction Temperature TJ Internally limited °C Operating Ambient Temperature TA -25 to +85 °C Storage Temperature TSTG -55 to +150 °C Parameter Symbol Value Unit 7DIP Junction-to-Ambient Thermal(1) θJA(3) 74.07 °C/W θJA(4) 60.44 °C/W Junction-to-Case Thermal(2) θJC 22.00 °C/W 7LSOP Junction-to-Ambient Thermal(1) θJA(5) 86.02 °C/W Junction-to-Case Thermal(2) θJC 27.72 °C/W |
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