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OPA2388IDGKR Datasheet(PDF) 7 Page - Texas Instruments

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Part No. OPA2388IDGKR
Description  OPAx388 Precision, Zero-Drift, Zero-Crossover, True Rail-to-Rail, Input/Output Operational Amplifiers
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

OPA2388IDGKR Datasheet(HTML) 7 Page - Texas Instruments

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OPA388, OPA2388, OPA4388
www.ti.com
SBOS777C – DECEMBER 2016 – REVISED MAY 2019
Product Folder Links: OPA388 OPA2388 OPA4388
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Copyright © 2016–2019, Texas Instruments Incorporated
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information: OPA388
THERMAL METRIC(1)
OPA388
UNIT
D (SOIC)
DBV (SOT-23)
DGK (VSSOP)
8 PINS
5 PINS
5 PINS
RθJA
Junction-to-ambient thermal resistance
116
145.7
177
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
60
94.8
69
°C/W
RθJB
Junction-to-board thermal resistance
56
43.4
100
°C/W
ΨJT
Junction-to-top characterization parameter
12.8
24.7
9.9
°C/W
ΨJB
Junction-to-board characterization parameter
55.9
43.1
98.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
n/a
n/a
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Thermal Information: OPA2388
THERMAL METRIC(1)
OPA2388
UNIT
DGK (VSSOP)
8 PINS
RθJA
Junction-to-ambient thermal resistance
165
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
53
°C/W
RθJB
Junction-to-board thermal resistance
87
°C/W
ΨJT
Junction-to-top characterization parameter
4.9
°C/W
ΨJB
Junction-to-board characterization parameter
85
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.6 Thermal Information: OPA4388
THERMAL METRIC(1)
OPA4388
UNIT
D (SOIC)
PW (TSSOP)
14 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
86.4
109.6
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
46.3
27.4
°C/W
RθJB
Junction-to-board thermal resistance
41.0
56.1
°C/W
ΨJT
Junction-to-top characterization parameter
11.3
1.5
°C/W
ΨJB
Junction-to-board characterization parameter
40.7
54.9
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
n/a
°C/W


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