5

399

Technical considerations

Stages

Precautions

SMD Inductors

，CM04RC，BU05MC

1.Circuit Design

2.PCB Design

3.Considerations for

automatic placement

4.Soldering

5.Cleaning

6.Handling

7.Storage conditions

Operating environment,

1.The products described in this specification are intended for

use

in

general

electronic

equipment,(office

supply

equipment,

telecommunications

systems,

measuring

equipment, and household equipment). They are not

intended for use in mission-critical equipment or systems

requiring special quality and high reliability (traffic systems,

safety equipment, aerospace systems, nuclear control

systems and medical equipment including life-support

systems,) where product failure might result in loss of life,

injury or damage. For such uses, contact TAIYO YUDEN

Sales Department in advance.

Land pattern design

1.Please contact any of our offices for a land pattern, and refer

to a recommended land pattern of specifications.

Adjustment of mounting machine

1.Excessive impact load should not be imposed on the

products when mounting onto the PC boards.

2.Mounting and soldering conditions should be checked

beforehand.

Reflow soldering

1.Please contact any of our offices for a reflow soldering, and

refer to the recommended condition specified.

2.This products is reflow soldering only.

3.SMD Inductors

Please do not add any stress to a product until it returns in

normal temperature after reflow soldering.

Lead free soldering

1.When using products with lead free soldering, we request to

use them after confirming of adhesion, temperature of

resistance to soldering heat, soldering etc sufficiently.

Recommended conditions for using a soldering iron:

Put the soldering iron on the land-pattern.

Soldering iron's temperature - Below 350

℃

Duration - 3 seconds or less

The soldering iron should not directly touch the inductor.

Cleaning conditions

1.SMD Inductors

Please contact any of our offices for a cleaning,

Handling

1.Keep the product away from all magnets and magnetic

objects.

Breakaway PC boards (splitting along perforations)

1.When splitting the PC board after mounting product, care

should be taken not to give any stresses of deflection or

twisting to the board.

2.Board separation should not be done manually, but by using

the appropriate devices.

Mechanical considerations

1.Please do not give the product any excessive mechanical

shocks.

2.SMD Inductors

Please do not add any shock and power to a product in

transportation.

Pick-up pressure

1.SMD Inductors

Please do not push to add any pressure to a winding part.

Please do not give any shock and push into a ferrite core

exposure part.

Packing

1.SMD Inductors

Please avoid accumulation of a packing box as much as

possible.

Storage

1.To maintain the solderability of terminal electrodes and to

keep the packing material in good condition, temperature

and humidity in the storage area should be controlled..

・Recommended conditions

 Ambient temperature      0∼40℃

 Humidity

 Below 70% RH

The ambient temperature must be kept below 30

℃. Even

under ideal storage conditions, solderability of products

electrodes may decrease as time passes. For this reason,

product should be used within one year from the time of

delivery.

In case of storage over 6 months, solderability shall be

checked before actual usage.

1. When installing products, care should be taken not to apply distortion stress as it may

deform the products.

1.If products are used beyond the range of the recommended conditions, heat stresses

may deform the products, and consequently degrade the reliability of the products.

1.There is a case that a characteristic varies with magnetic influence.

1.Planning pattern configurations and the position of products should be carefully

performed to minimize stress.

1.There is a case to be damaged by a mechanical shock.

2.SMD Inductors

There is a case to be broken by the handling in transportation.

1.SMD Inductors

Damage and a characteristic can vary with an excessive shock or stress.

1.There is a case that transformation and a product of tape are damaged by

accumulation of a packing box.

1. Under a high temperature and humidity environment, problems such as reduced

solderability caused by oxidation of terminal electrodes and deterioration

of taping/packaging materials may take place.

PRECAUTIONS