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CM05MC09T Datasheet(PDF) 10 Page - Taiyo Yuden (U.S.A.), Inc |
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CM05MC09T Datasheet(HTML) 10 Page - Taiyo Yuden (U.S.A.), Inc |
10 / 10 page 5 399 Technical considerations Stages Precautions SMD Inductors ,CM04RC,BU05MC 1.Circuit Design 2.PCB Design 3.Considerations for automatic placement 4.Soldering 5.Cleaning 6.Handling 7.Storage conditions Operating environment, 1.The products described in this specification are intended for use in general electronic equipment,(office supply equipment, telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance. Land pattern design 1.Please contact any of our offices for a land pattern, and refer to a recommended land pattern of specifications. Adjustment of mounting machine 1.Excessive impact load should not be imposed on the products when mounting onto the PC boards. 2.Mounting and soldering conditions should be checked beforehand. Reflow soldering 1.Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified. 2.This products is reflow soldering only. 3.SMD Inductors Please do not add any stress to a product until it returns in normal temperature after reflow soldering. Lead free soldering 1.When using products with lead free soldering, we request to use them after confirming of adhesion, temperature of resistance to soldering heat, soldering etc sufficiently. Recommended conditions for using a soldering iron: Put the soldering iron on the land-pattern. Soldering iron's temperature - Below 350 ℃ Duration - 3 seconds or less The soldering iron should not directly touch the inductor. Cleaning conditions 1.SMD Inductors Please contact any of our offices for a cleaning, Handling 1.Keep the product away from all magnets and magnetic objects. Breakaway PC boards (splitting along perforations) 1.When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board. 2.Board separation should not be done manually, but by using the appropriate devices. Mechanical considerations 1.Please do not give the product any excessive mechanical shocks. 2.SMD Inductors Please do not add any shock and power to a product in transportation. Pick-up pressure 1.SMD Inductors Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part. Packing 1.SMD Inductors Please avoid accumulation of a packing box as much as possible. Storage 1.To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should be controlled.. ・Recommended conditions Ambient temperature 0∼40℃ Humidity Below 70% RH The ambient temperature must be kept below 30 ℃. Even under ideal storage conditions, solderability of products electrodes may decrease as time passes. For this reason, product should be used within one year from the time of delivery. In case of storage over 6 months, solderability shall be checked before actual usage. 1. When installing products, care should be taken not to apply distortion stress as it may deform the products. 1.If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of the products. 1.There is a case that a characteristic varies with magnetic influence. 1.Planning pattern configurations and the position of products should be carefully performed to minimize stress. 1.There is a case to be damaged by a mechanical shock. 2.SMD Inductors There is a case to be broken by the handling in transportation. 1.SMD Inductors Damage and a characteristic can vary with an excessive shock or stress. 1.There is a case that transformation and a product of tape are damaged by accumulation of a packing box. 1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. PRECAUTIONS |
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