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FAN5332A Datasheet(PDF) 3 Page - Fairchild Semiconductor |
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FAN5332A Datasheet(HTML) 3 Page - Fairchild Semiconductor |
3 / 9 page 3 www.fairchildsemi.com FAN5332A Rev. 1.0.1 Absolute Maximum Ratings (Note1) Recommended Operating Conditions Notes: 1. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. 2. Junction to ambient thermal resistance, θJA, is a strong function of PCB material, board thickness, thickness and number of copper planes, number of via used, diameter of via used, available copper surface, and attached heat sink characteristics. 3. Using EIA/JESD22A114B (Human Body Model) and EIA/JESD22C101-A (Charge Device Model). 4. This load capacitance value is required for the loop stability. Tolerance, temperature variation, and voltage dependency of the capacitance must be considered. Typically a 2.2µF ceramic capacitor is required to achieve specified value at VOUT = 30V. Parameter Min Max Unit VIN to GND 6.0 V FB, SHDN to GND -0.3 VIN + 0.3 V SW to GND -0.3 35 V Lead Soldering Temperature (10 seconds) 300 °C Junction Temperature 150 °C Storage Temperature -55 150 °C Thermal Resistance ( ΘJA) (Note 2) 200 °C/W Electrostatic Discharge Protection (ESD) Level (Note 3) HBM 2 kV CDM 1 Parameter Min Typ Max Unit Input Voltage 2.7 5.5 V Output Voltage 12 30 V Operating Ambient Temperature -40 25 85 °C Output Capacitance (Note 4) 1.6 µF |
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