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ISL3873A Datasheet(PDF) 42 Page - Intersil Corporation

Part No. ISL3873A
Description  Wireless LAN Integrated Medium Access Controller with Baseband Processor
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Maker  INTERSIL [Intersil Corporation]
Homepage  http://www.intersil.com/cda/home
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ISL3873A Datasheet(HTML) 42 Page - Intersil Corporation

 
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All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable.
However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its
use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
7585 Irvine Center Drive
Suite 100
Irvine, CA 92618
TEL: (949) 341-7000
FAX: (949) 341-7123
Intersil Corporation
2401 Palm Bay Rd.
Palm Bay, FL 32905
TEL: (321) 724-7000
FAX: (321) 724-7946
EUROPE
Intersil Europe Sarl
Ave. C - F Ramuz 43
CH-1009 Pully
Switzerland
TEL: +41 21 7293637
FAX: +41 21 7293684
ASIA
Intersil Corporation
Unit 1804 18/F Guangdong Water Building
83 Austin Road
TST, Kowloon Hong Kong
TEL: +852 2723 6339
FAX: +852 2730 1433
ISL3873A
Plastic Ball Grid Array Packages (BGA)
o
TOP VIEW
D
A1
BOTTOM VIEW
P
N
L
M
J
K
G
H
F
E
8
13
14
12 11 10 9
CORNER
765
3
42
C
D
A
B
1
SIDE VIEW
SEATING PLANE
C
A
A1
A2
bbb
C
aaa
A1
E
A
B
E1
D1
b
S
ALL ROWS AND COLUMNS
S
M
A B
C
C
0.15
0.08
M
0.006
0.003
A1
A1
CORNER I.D.
e
A
A
C
R
T
15
16
CORNER
CORNER I.D.
V192.14x14
192 BALL PLASTIC BALL GRID ARRAY PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MINMAX
MINMAX
A
-
0.059
-
1.40
-
A1
0.012
0.016
0.31
0.41
-
A2
0.033
0.039
0.83
0.99
-
b
0.016
0.020
0.41
0.51
7
D/E
0.547
0.555
13.90
14.10
-
D1/E1
0.468
0.476
11.90
12.10
-
N
192
192
-
e
0.032 BSC
0.80 BSC
-
MD/ME
16 x 16
16 x 16
3
bbb
0.004
0.10
-
aaa
0.005
0.12
-
Rev. 1 1/01
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3. “MD” and “ME” are the maximum ball matrix size for the “D”
and “E” dimensions, respectively.
4. “N” is the maximum number of balls for the specific array size.
5. Primary datum C and seating plane are defined by the spher-
ical crowns of the contact balls.
6. Dimension “A” includes standoff height “A1”, package body
thickness and lid or cap height “A2”.
7. Dimension “b” is measured at the maximum ball diameter,
parallel to the primary datum C.
8. Pin “A1” is marked on the top and bottom sides adjacent to A1.
9. “S” is measured with respect to datum’s A and B and defines
the position of the solder balls nearest to package center-
lines. When thereisanevennumber of balls in theouter row
the value is “S” = e/2.


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