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FAN2559MP18X Datasheet(PDF) 8 Page - Fairchild Semiconductor |
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FAN2559MP18X Datasheet(HTML) 8 Page - Fairchild Semiconductor |
8 / 15 page FAN2558/FAN2559 PRODUCT SPECIFICATIONS 8 REV. 1.0.4 3/15/04 General PCB Layout Considerations For optimum device performance, careful circuit layout and grounding techniques must be used. Establishing a small local ground, to which the GND pin, and the output and bypass capacitors are connected, is recommended. The input capacitor should be grounded to the main ground plane. The quiet local ground is then routed back to the main ground plane using feed through via. In general, the high-frequency compensation components (input, bypass, and output capaci- tors) should be located as close to the device as possible. Close proximity of the output capacitor is especially impor- tant to achieve optimum performance, especially during high load conditions. A large copper area in the local ground serves as heat sink (as discussed above) when high power dissipation significantly increases device temperature. Com- ponent-side copper provides significantly better thermal per- formance. Added feed through connecting the device side ground plane to the back plane further reduces thermal resis- tance. |
Similar Part No. - FAN2559MP18X |
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Similar Description - FAN2559MP18X |
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