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ZL40539 Datasheet(PDF) 3 Page - Zarlink Semiconductor Inc

Part No. ZL40539
Description  Dual Output CD and DVD 4 Channel Laser Diode Driver
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Maker  ZARLINK [Zarlink Semiconductor Inc]
Homepage  http://www.zarlink.com
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ZL40539 Datasheet(HTML) 3 Page - Zarlink Semiconductor Inc

 
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ZL40539
Data Sheet
3
Zarlink Semiconductor Inc.
Application Notes
Read and Write Channel Operation
The device is activated by applying a 'High' signal to the Enable pin. In this mode, the read channel can be enabled
with a low signal on ENRB. The fast write channels can be enabled by applying a 'High' signal to the respective pair
of write enable pins (EN2P, EN2N), (EN3P, EN3N), or (EN4P, EN4N). The output currents of the four channels are
summed together and output as a composite signal at either OUTA (if SELA select is 'High') or OUTB (if SELA
select is 'Low'). This provides the ability to drive two different laser diodes with just one ZL40539.
Voltage control of the channel reference inputs (INR, IN2, IN3 and IN4) can be achieved quite easily using an
external resistor Rref in series with the reference channel input to convert a given reference potential Vref to an input
current, Iin:
,
where Rin is the input impedance of the respective reference channel.
On-chip RF Oscillator
An on-chip RF oscillator is enabled if OSCEN = 'High', and its output signal is added to the appropriate current
output (OUTA, if SELA select is 'High', or OUTB, if SELA select is 'Low'). The oscillator amplitude is set by an
external resistor from RSA or RSB to GND. Its frequency is set by an external resistor RFA or RFB to GND. RSA
and RFA are selected when SELA is ‘High’
The oscillator signal is summed with the programmed Write and Read levels before amplification to the output. The
oscillator signal has zero DC level and +I_pk to –I_pk signal swing. Consequently, if the programmed DC level from
the Write and Read Channels is less than the PK level programmed for the Oscillator, the combined signal will be
clipped on the negative cycle of the signal. This will increase the harmonic content of the output signal and reduce
the pk to pk amplitude output.
Thermal Considerations
Package thermal resistance is 40
°C/W under the EIA/JESD51-3 compliant PCB test board condition.
Users should ensure that the junction temperature does not exceed 150
°C. Thermal resistance from junction to
case and to ambient is very much dependent on how the IC is mounted onto the board, on the PCB layout and on
any heat extraction arrangements.
Power consumption and system ambient operating temperature limits should be noted and careful thermal gradient
calculations undertaken to ensure that the junction temperature never exceeds 150
°C.
in
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