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Aug. 13, 2003 V.06
Surface Mount Multilayer Ceramic Capacitors
7
8
SERIES
CC
X7R, 16V to 100V
PACKING METHOD
LLEEA
AD
DEER
R//T
TR
RA
AIILLEER
R T
TA
APPEE SSPPEEC
CIIFFIIC
CA
AT
TIIO
ON
N
MEA529 - 2
empty compartments
with cover tape
cover tape only
120
40 mm
leader
400 mm
trailer (max. 260 mm)
trailer end
leader end
Fig. 6 Leader and trailer tape dimension
METHOD OF MOUNTING
For normal use the capacitors may
be mounted on printed-circuit
boards or ceramic substrates by
applying wave soldering, reflow
soldering (including vapor phase
soldering) or conductive adhesive
in accordance with CECC 00802
classification A.
0
50
100
150
200
250
300
250
200
150
100
50
0
10 s
235 ¡C to 260 ¡C
second wave
5 K/s
2 K/s
first wave
200 K/s
100 ¡C to 130 ¡C
forced
cooling
2 K/s
(¡C)
t (s)
T
MLA861
Fig. 8 Recommended wave soldering profile
Typical values (sold line)
Process limits (dotted lines)
The capacitors may be soldered twice in accordance with this method if desired
0
50
100
150
200
250
300
250
200
150
100
50
0
10 s
260 ¡C
130 ¡C
(¡C)
t (s)
MLA859
245 ¡C
215 ¡C
180 ¡C
10 s
40 s
2 K/s
T
Fig. 7 Recommended reflow soldering profile
Typical values (sold line)
Process limits (dotted lines)
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