7

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FN8230.3

October 7, 2005

ISL90462

Small Outline Transistor Plastic Packages (SC70-6)

D

e1

E

C

L

e

b

C

L

A2

A

A1

C

L

0.20 (0.008) M

0.10 (0.004) C

C

-C-

SEATING

PLANE

12

3

4

5

6

E1

C

L

C

VIEW C

VIEW C

L

R1

R

4X

θ1

4X

θ1

GAUGE PLANE

L1

SEATING

α

L2

C

PLANE

c

BASE METAL

WITH

c1

b1

PLATING

b

P6.049

6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

0.031

0.043

0.80

1.10

-

A1

0.000

0.004

0.00

0.10

-

A2

0.031

0.039

0.00

1.00

-

b

0.006

0.012

0.15

0.30

-

b1

0.006

0.010

0.15

0.25

c

0.003

0.009

0.08

0.22

6

c1

0.003

0.009

0.08

0.20

6

D

0.073

0.085

1.85

2.15

3

E

0.071

0.094

1.80

2.40

-

E1

0.045

0.053

1.15

1.35

3

e

0.0256 Ref

0.65 Ref

-

e1

0.0512 Ref

1.30 Ref

-

L

0.010

0.018

0.26

0.46

4

L1

0.017 Ref.

0.420 Ref.

L2

0.006 BSC

0.15 BSC

N6

6

5

R

0.004

-

0.10

-

R1

0.004

0.010

0.15

0.25

α

-

Rev. 2 9/03

NOTES:

1. Dimensioning and tolerance per ASME Y14.5M-1994.

2. Package conforms to EIAJ SC70 and JEDEC MO203AB.

3. Dimensions D and E1 are exclusive of mold flash, protrusions,

or gate burrs.

4. Footlength L measured at reference to gauge plane.

5. “N” is the number of terminal positions.

6. These Dimensions apply to the flat section of the lead between

0.08mm and 0.15mm from the lead tip.

7. Controlling dimension: MILLIMETER. Converted inch dimen-

sions are for reference only