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LMV321A Datasheet(PDF) 7 Page - Texas Instruments

Part # LMV321A
Description  LMV3xxA Low-Voltage Rail-to-Rail Output Operational Amplifiers
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LMV321A Datasheet(HTML) 7 Page - Texas Instruments

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LMV321A, LMV324A, LMV358A
www.ti.com
SBOS923F – DECEMBER 2017 – REVISED JANUARY 2020
Product Folder Links: LMV321A LMV324A LMV358A
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Copyright © 2017–2020, Texas Instruments Incorporated
(1)
For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
6.4 Thermal Information: LMV321A
THERMAL METRIC(1)
LMV321A
UNIT
DBV (SOT-23)
DCK (SC70)
5 PINS
5 PINS
RθJA
Junction-to-ambient thermal resistance
232.8
239.6
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
153.8
148.5
°C/W
RθJB
Junction-to-board thermal resistance
100.9
82.3
°C/W
ψJT
Junction-to-top characterization parameter
77.2
54.5
°C/W
ψJB
Junction-to-board characterization parameter
100.4
81.8
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
6.5 Thermal Information: LMV358A
THERMAL METRIC(1)
LMV358A
UNIT
D (SOIC)
DGK (VSSOP)
PW (TSSOP)
DDF (SOT-23)
8 PINS
8 PINS
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
147.4
201.2
205.8
183.7
°C/W
RθJC(top) Junction-to-case (top) thermal resistance
94.3
85.7
106.7
112.5
°C/W
RθJB
Junction-to-board thermal resistance
89.5
122.9
133.9
98.2
°C/W
ψJT
Junction-to-top characterization parameter
47.3
21.2
34.4
18.8
°C/W
ψJB
Junction-to-board characterization parameter
89
121.4
132.6
97.6
°C/W
(1)
For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
6.6 Thermal Information: LMV324A
THERMAL METRIC(1)
LMV324A
UNIT
D (SOIC)
PW (TSSOP)
14 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
102.1
148.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
56.8
68.1
°C/W
RθJB
Junction-to-board thermal resistance
58.5
92.7
°C/W
ψJT
Junction-to-top characterization parameter
20.5
16.9
°C/W
ψJB
Junction-to-board characterization parameter
58.1
91.8
°C/W


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