EP7312 datasheet(38/64 Pages) CIRRUS

Part #	EP7312

Description	HIGH-PERFORMANCE, LOW-POWER SYSTEM ON CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE

Download	64 Pages

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Manufacturer	CIRRUS [Cirrus Logic]

Direct Link	http://www.cirrus.com

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38 / 64 page

38

©Copyright Cirrus Logic, Inc. 2003

DS508PP5

EP7312

High-Performance, Low-Power System on Chip

204-Ball TFBGA Package Characteristics

Figure 17. 204-Ball TFBGA Package

Ø0.25~0.35(204X)

Ø0.15 M C A B

Ø0.08 M C

0.15(4X) C

SEATING PLANE

TOP VIEW

BOTTOM VIEW

13±0.05

A

B

C

Ball Diameter :

Ball Pitch :

0.53

0.3

Substrate Thickness :

Mold Thickness :

0.65

0.36

20

Y

W

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R

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C

B

A

19 18 17 16 15 14 13 12 11 10 98

7654 3

2 1

0.65

17

19 20

18

16

14 15

12 13

910 11

78

456

23

1

C

K

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A1 CORNER

12.35

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EP7312 Datasheet(PDF) 38 Page - Cirrus Logic

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