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NCP502ASQ50T1 Datasheet(PDF) 3 Page - ON Semiconductor |
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NCP502ASQ50T1 Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 10 page NCP502, NCP502A http://onsemi.com 3 ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 2.0 V, Venable = Vin, Cin = 1.0 mF, Cout = 1.0 mF, TJ = 25°C, unless otherwise noted.) Characteristic Symbol Min Typ Max Unit Output Voltage (TA = 25°C, Iout = 10 mA) Vin = Vout (nom.) +1.0 V 1.5 V 1.8 V 2.5 V 2.7 V 2.8 V 3.0 V 3.3 V 3.5 V 5.0 V Vout 1.455 1.746 2.425 2.646 2.744 2.94 3.234 3.43 4.900 1.5 1.8 2.5 2.7 2.8 3.0 3.3 3.5 5.0 1.545 1.854 2.575 2.754 2.856 3.06 3.366 3.57 5.100 V Output Voltage (TA = −40°C to 85°C, Iout = 10 mA) Vin = Vout (nom.) 1.5 V 1.8 V 2.5 V 2.7 V 2.8 V 3.0 V 3.3 V 3.5 V 5.0 V Vout 1.455 1.746 2.425 2.619 2.716 2.910 3.201 3.43 4.900 1.5 1.8 2.5 2.7 2.8 3.0 3.3 3.5 5.0 1.545 1.854 2.575 2.781 2.884 3.09 3.399 3.57 5.100 V Line Regulation (Vin = Vout + 1.0 V to 12 V, Iout = 10 mA) Regline − 0.4 3.0 mV/V Load Regulation (Iout = 1.0 mA to 80 mA) Regload − 0.2 0.8 mV/mA Output Current (Vout = (Vout at Iout = 80 mA) −3%) Io(nom.) 80 180 − mA Dropout Voltage (TA = −40°C to 85°C, Iout = 80 mA, Measured at Vout −3.0%) 1.5 V−1.7 V 1.8 V−2.4 V 2.5 V−2.6 V 2.7 V−2.9 V 3.0 V−4.0 V 4.1 V−5.0 V Vin−Vout − − − − − − 1500 1300 1000 850 850 600 1900 1700 1400 1300 1200 900 mV Quiescent Current (Enable Input = 0 V) (Enable Input = Vin, Iout = 1.0 mA to Io(nom.)) IQ − − 0.1 40 1.0 90 mA Output Short Circuit Current (Vout = 0 V) Iout(max) 90 200 500 mA Ripple Rejection (f = 1.0 kHz, 15 mA) RR − 55 − dB Output Voltage Noise (f = 100 Hz to 100 kHz) Vn − 180 − mVrms Enable Input Threshold Voltage (NCP502) (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Vth(en) 1.3 − − − − 0.3 V Enable Input Threshold Voltage (NCP502A) (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Vth(en) 1.0 − − − − 0.4 V Output Voltage Temperature Coefficient TC − 100 − ppm/°C 3. Maximum package power dissipation limits must be observed. PD + TJ(max) *TA RqJA 4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. |
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