TRF1223 datasheet(8/10 Pages) TI

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0.25 TYP

0.75 TYP

SOLDER MASK: NO SOLDERMASK UNDER CHIP, ON LEAD PADS

OR ON GROUND CONNECTIONS.

25 VIA HOLES, MIN, EACH 0.38 mm.

DIMENSIONS in mm

DIA 0.38

TYP

0.60 TYP

3.50

3.80

0.50 TYP

0.20 TYP

PIN 1

Additional Copper

Ground and via Holes at

Customer Discreation

TRF1223

SLWS166A – APRIL 2005 – REVISED JULY 2005

Table 2. PCB Recommendations (continued)

Final Plate

White immersion tin

Final Board Thickness

33 to 37 mil

Figure 7. Recommended Pad Layout

8

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