PS7241E-1A

(1) Infrared reflow soldering

• Peak reflow temperature

260°C or below (package surface temperature)

• Time of peak reflow temperature

10 seconds or less

• Time of temperature higher than 220°C

60 seconds or less

• Time to preheat temperature from 120 to 180°C 120±30 s

• Number of reflows

Three

• Flux

Rosin flux containing small amount of chlorine (The flux with a

maximum chlorine content of 0.2 Wt% is recommended.)

(2) Wave soldering

• Temperature

260°C or below (molten solder temperature)

• Time

10 seconds or less

• Preheating conditions

120°C or below (package surface temperature)

• Number of times

One

• Flux

Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of

0.2 Wt% is recommended.)

(3) Cautions

• Fluxes

Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.

RECOMMENDED SOLDERING CONDITIONS

A Business Partner of NEC Compound Semiconductor Devices, Ltd.

12/02/2004

Life Support Applications

These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably

be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and

agree to fully indemnify CEL for all damages resulting from such improper use or sale.

220ºC

Time (s)

(heating)

to 10 s

to 60 s

260ºC MAX.

Recommended Temperature Profile of Infrared Reflow

120±30 s

(preheating)

180ºC

120ºC