220°C

Time (s)

(heating)

to 10 s

to 60 s

260°C MAX.

Recommended Temperature Profile of Infrared Reflow

120±30 s

(preheating)

180°C

120°C

PS7205B-1A

EXCLUSIVE NORTH AMERICAN AGENT FOR NEC RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS

CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279

Internet: http://WWW.CEL.COM

03/04/2002

DATA SUBJECT TO CHANGE WITHOUT NOTICE

RECOMMENDED SOLDERING CONDITIONS

(1) Infrared reflow soldering

• Peak reflow temperature

260 °C or below (package surface temperature)

•Time of peak reflow temperature

10 seconds or less

•Time of temperature higher than 220 °C

60 seconds or less

•Time to preheat temperature from 120 to 180°C

120±30 s

• Number of reflows

Three

• Flux

Rosin flux containing small amount of chlorine

(The flux with a maximum chlorine content of 0.2 Wt % is recommended.)

(2) Wave soldering

•Temperature

260 °C or below (molten solder temperature)

•Time

10 seconds or less

• Preheating conditions

120°C or below (package surface temperature)

• Number of times

One (Allowed to be dipped in solder including plastic mold portion.)

• Flux

Rosin flux containing small amount of chlorine

(The flux with a maximum chlorine content of 0.2 Wt % is recommended.)

(3) Cautions

• Fluxes

Avoid removing the residual flux with freon-based cleaning solvent.