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A82DL3234TG-70U Datasheet(PDF) 3 Page - AMIC Technology

Part # A82DL3234TG-70U
Description  Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash
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Manufacturer  AMICC [AMIC Technology]
Direct Link  http://www.amictechnology.com
Logo AMICC - AMIC Technology

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A82DL32x4T(U) Series
PRELIMINARY
(August, 2005, Version 0.0)
2
AMIC Technology, Corp.
GENERAL DESCRIPTION
The A82DL32x4T(U) family consists of 32 megabit, 3.0 volt-
only flash memory devices, organized as 2,097,152 words of
16 bits each or 4,194,304 bytes of 8 bits each. Word mode
data appears on I/O0–I/O15; byte mode data appears on I/O0
I/O7. The device is designed to be programmed in-system
with the standard 3.0 volt VCC supply, and can also be
programmed in standard EPROM programmers.
The device is available with an access time of 70ns. The
devices are offered in 69-ball Fine-pitch BGA. Standard
control pins—chip enable ( CE_F ), write enable ( WE ), and
output enable ( OE )—control normal read and write
operations, and avoid bus contention issues.
The device requires only a single 3.0 volt power supply for
both read and write functions. Internally generated and
regulated voltages are provided for the program and erase
operations.
Simultaneous Read/Write Operations with Zero
Latency
The
Simultaneous
Read/Write
architecture
provides
simultaneous operation by dividing the memory space into
two
banks.
The
device
can
improve
overall
system
performance by allowing a host system to program or erase
in one bank, then immediately and simultaneously read from
the other bank, with zero latency. This releases the system
from waiting for the completion of program or erase
operations.
The A82DL32x4T(U) devices uses multiple bank archi-
tectures to provide flexibility for different applications. Three
devices are available with these bank sizes:
Device
Bank 1
Bank 2
DL3224
4 Mb
28 Mb
DL3234
8 Mb
24 Mb
DL3244
16 Mb
16 Mb
A82DL32x4T(U) Features
The device offers complete compatibility with the JEDEC
single-power-supply
Flash
command
set
standard.
Commands are written to the command register using
standard microprocessor write timings. Reading data out of
the device is similar to reading from other Flash or EPROM
devices.
The host system can detect whether a program or erase
operation is complete by using the device status bits:
RY/
BY pin, I/O7 ( Data Polling) and I/O6/I/O2 (toggle bits).
After a program or erase cycle has been completed, the
device automatically returns to reading array data.
The sector erase architecture allows memory sectors to be
erased
and
reprogrammed
without
affecting
the
data
contents of other sectors. The device is fully erased when
shipped from the factory.
Hardware data protection measures include a low VCC
detector that automatically inhibits write operations during
power transitions. The hardware sector protection feature
disables
both
program
and
erase
operations
in
any
combination of the sectors of memory. This can be achieved
in-s y s t e m or via programming equipment.
The
device
offers
two
power-saving
features.
When
addresses have been stable for a specified amount of time,
the device enters the automatic sleep mode. The system
can also place the device into the standby mode. Power
consumption is greatly reduced in both modes.


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